26-8125 Series
Manufacturer: Aries Electronics
Beta
⌘K
CONN IC DIP SOCKET 26POS GOLD
| Part | Termination Post Length | Termination Post Length | Material Flammability Rating | Current Rating (Amps) | Type | Type | Type | Mounting Type | Contact Material - Mating | Housing Material | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Finish - Post | Contact Finish - Mating | Pitch - Post | Pitch - Post | Contact Material - Post [custom] | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Termination | Operating Temperature [Min] | Operating Temperature [Max] | Pitch - Mating | Pitch - Mating | Features | Type [custom] | Type [custom] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Aries Electronics | 3.56 mm | 0.14 in | UL94 V-0 | 3 A | 7.62 mm | 0.3 in | DIP | Through Hole | Beryllium Copper | Polyamide (PA46) Nylon 4/6 Glass Filled | 10 Áin | 0.25 çm | Gold | Gold | 0.1 in | 2.54 mm | Brass | 0.76 Ám | 30 Áin | Solder | -55 C | 105 ░C | 0.1 " | 2.54 mm | Closed Frame Elevated | ||
Aries Electronics | 3.56 mm | 0.14 in | UL94 V-0 | 3 A | DIP | Through Hole | Beryllium Copper | Polyamide (PA46) Nylon 4/6 Glass Filled | 10 Áin | 0.25 çm | Gold | Gold | 0.1 in | 2.54 mm | Brass | 0.76 Ám | 30 Áin | Solder | -55 C | 105 ░C | 0.1 " | 2.54 mm | Closed Frame Elevated | 15.24 mm | 0.6 in |