TLV5619-EP Series

Enhanced Product 12-Bit, Single Channel Dac, Parallel, Voltage Out, Low Power

Catalog

Enhanced Product 12-Bit, Single Channel Dac, Parallel, Voltage Out, Low Power

Part	Operating Temperature [Max]	Operating Temperature [Min]	Mounting Type	Voltage - Supply, Analog	Voltage - Supply, Analog [Max]	Voltage - Supply, Analog [Min]	Architecture	INL/DNL (LSB)	Supplier Device Package	Settling Time	Output Type	Reference Type	Data Interface	Package / Case	Package / Case [y]	Package / Case [y]	Voltage - Supply, Digital [Min]	Voltage - Supply, Digital	Voltage - Supply, Digital [Max]	Number of Bits	Package / Case [x]
Texas Instruments TLV5619IDWG4	85 °C	-40 °C	Surface Mount	5 V	3.3 V	2.7 V	String DAC	0.4 LSB 1.5 LSB	20-SOIC	3 µs	Voltage - Buffered	External	Parallel	20-SOIC	0.295 in	7.5 mm	2.7 V	5 V	3.3 V	12 bits
Texas Instruments TLV5619IDWR	85 °C	-40 °C	Surface Mount	5 V	3.3 V	2.7 V	String DAC	0.4 LSB 1.5 LSB	20-SOIC	3 µs	Voltage - Buffered	External	Parallel	20-SOIC	0.295 in	7.5 mm	2.7 V	5 V	3.3 V	12 bits
Texas Instruments TLV5619CDWR	70 °C	0 °C	Surface Mount	5 V	3.3 V	2.7 V	String DAC	0.4 LSB 1.5 LSB	20-SOIC	3 µs	Voltage - Buffered	External	Parallel	20-SOIC	0.295 in	7.5 mm	2.7 V	5 V	3.3 V	12 bits
Texas Instruments TLV5619QDWG4	125 °C	-40 °C	Surface Mount	5 V	3.3 V	2.7 V	String DAC	0.4 LSB 1.5 LSB	20-SOIC	3 µs	Voltage - Buffered	External	Parallel	20-SOIC	0.295 in	7.5 mm	2.7 V	5 V	3.3 V	12 bits
Texas Instruments TLV5619IPWR	85 °C	-40 °C	Surface Mount	5 V	3.3 V	2.7 V	String DAC	0.4 LSB 1.5 LSB	20-TSSOP	3 µs	Voltage - Buffered	External	Parallel	20-TSSOP	4.4 mm		2.7 V	5 V	3.3 V	12 bits	0.173 in
Texas Instruments TLV5619CDW	70 °C	0 °C	Surface Mount	5 V	3.3 V	2.7 V	String DAC	0.4 LSB 1.5 LSB	20-SOIC	3 µs	Voltage - Buffered	External	Parallel	20-SOIC	0.295 in	7.5 mm	2.7 V	5 V	3.3 V	12 bits
Texas Instruments TLV5619IDW	85 °C	-40 °C	Surface Mount	5 V	3.3 V	2.7 V	String DAC	0.4 LSB 1.5 LSB	20-SOIC	3 µs	Voltage - Buffered	External	Parallel	20-SOIC	0.295 in	7.5 mm	2.7 V	5 V	3.3 V	12 bits
Texas Instruments TLV5619IPW	85 °C	-40 °C	Surface Mount	5 V	3.3 V	2.7 V	String DAC	0.4 LSB 1.5 LSB	20-TSSOP	3 µs	Voltage - Buffered	External	Parallel	20-TSSOP	4.4 mm		2.7 V	5 V	3.3 V	12 bits	0.173 in
Texas Instruments TLV5619CPW	70 °C	0 °C	Surface Mount	5 V	3.3 V	2.7 V	String DAC	0.4 LSB 1.5 LSB	20-TSSOP	3 µs	Voltage - Buffered	External	Parallel	20-TSSOP	4.4 mm		2.7 V	5 V	3.3 V	12 bits	0.173 in
Texas Instruments TLV5619QDWREP	125 °C	-40 °C	Surface Mount	5 V	3.3 V	2.7 V	String DAC	0.4 LSB 1.5 LSB	20-SOIC	3 µs	Voltage - Buffered	External	Parallel	20-SOIC	0.295 in	7.5 mm	2.7 V	5 V	3.3 V	12 bits

Catalog

Enhanced Product 12-Bit, Single Channel Dac, Parallel, Voltage Out, Low Power

Key Features

• Controlled BaselineOne Assembly/Test Site, One Fabrication SiteExtended Temperature Performance of –40°C to 125°CEnhanced Diminishing Manufacturing Sources (DMS) SupportEnhanced Product Change NotificationQualification PedigreeSingle Supply 2.7-V to 5.5-V Operation±0.4 LSB Differential Nonlinearity (DNL), ±1.5 LSB Integral Nonlinearity (INL)12-Bit Parallel InterfaceCompatible With TMS320 DSPInternal Power On ResetSettling Time 1 µs TypLow Power Consumption:8 mW for 5-V Supply4.3 mW for 3-V SupplyReference Input BuffersVoltage OutputMonotonic Over TemperatureAsynchronous UpdateapplicationsBattery Powered Test InstrumentsDigital Offset and Gain AdjustmentBattery Operated/Remote Industrial ControlsMachine and Motion Control DevicesCordless and Wireless TelephonesSpeech SynthesisCommunication ModulatorsArbitrary Waveform GenerationComponent qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits.Controlled BaselineOne Assembly/Test Site, One Fabrication SiteExtended Temperature Performance of –40°C to 125°CEnhanced Diminishing Manufacturing Sources (DMS) SupportEnhanced Product Change NotificationQualification PedigreeSingle Supply 2.7-V to 5.5-V Operation±0.4 LSB Differential Nonlinearity (DNL), ±1.5 LSB Integral Nonlinearity (INL)12-Bit Parallel InterfaceCompatible With TMS320 DSPInternal Power On ResetSettling Time 1 µs TypLow Power Consumption:8 mW for 5-V Supply4.3 mW for 3-V SupplyReference Input BuffersVoltage OutputMonotonic Over TemperatureAsynchronous UpdateapplicationsBattery Powered Test InstrumentsDigital Offset and Gain AdjustmentBattery Operated/Remote Industrial ControlsMachine and Motion Control DevicesCordless and Wireless TelephonesSpeech SynthesisCommunication ModulatorsArbitrary Waveform GenerationComponent qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits.

Description

The TLV5619 is a 12-bit voltage output DAC with a microprocessor and TMS320 compatible parallel interface. The 12 data bits are double buffered so that the output can be updated asynchronously using the LDAC\ pin. During normal operation, the device dissipates 8 mW at a 5-V supply and 4.3 mW at a 3-V supply. The power consumption can be lowered to 50 nW by setting the DAC to power-down mode. The output voltage is buffered by a ×2 gain rail-to-rail amplifier, which features a Class A output stage to improve stability and reduce settling time. The TLV5619 is a 12-bit voltage output DAC with a microprocessor and TMS320 compatible parallel interface. The 12 data bits are double buffered so that the output can be updated asynchronously using the LDAC\ pin. During normal operation, the device dissipates 8 mW at a 5-V supply and 4.3 mW at a 3-V supply. The power consumption can be lowered to 50 nW by setting the DAC to power-down mode. The output voltage is buffered by a ×2 gain rail-to-rail amplifier, which features a Class A output stage to improve stability and reduce settling time.