24-655 Series

Catalog

CONN IC DIP SOCKET 24POS GOLD

Part	Termination Post Length	Termination Post Length	Current Rating (Amps)	Material Flammability Rating	Type [custom]	Type [custom]	Type	Pitch - Mating	Pitch - Mating	Housing Material	Contact Material - Post [custom]	Pitch - Post	Pitch - Post	Contact Finish - Mating	Contact Material - Mating	Features	Number of Positions or Pins (Grid) [x]	Number of Positions or Pins (Grid) [y]	Number of Positions or Pins (Grid)	Contact Finish - Post	Mounting Type	Termination	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Material - Post	Type
Aries Electronics 24-6556-10	3.3 mm	0.13 in	3 A	UL94 V-0	15.24 mm	0.6 in	DIP	0.1 "	2.54 mm	Polyphenylene Sulfide (PPS) Glass Filled	Brass	0.1 in	2.54 mm	Gold	Beryllium Copper	Open Frame	12	2	24	Tin	Through Hole	Solder	200 µin	5.08 µm	0.76 Ám	30 Áin
Aries Electronics 24-6556-40	4.57 mm	0.18 in	3 A	UL94 V-0	15.24 mm	0.6 in	DIP	0.1 "	2.54 mm	Polyphenylene Sulfide (PPS) Glass Filled	Brass	0.1 in	2.54 mm	Gold	Beryllium Copper	Open Frame	12	2	24	Tin	Through Hole		200 µin	5.08 µm	0.76 Ám	30 Áin
Aries Electronics 24-6551-11	2.78 mm	0.11 in	1 A	UL94 V-0			DIP ZIF (ZIP)	0.1 "	2.54 mm	Polyphenylene Sulfide (PPS) Glass Filled		0.1 in	2.54 mm	Gold	Beryllium Copper	Closed Frame	12	2	24	Gold	Through Hole	Solder					Beryllium Copper	0.6 " (15.24mm) Row Spacing
Aries Electronics 24-6553-10	2.78 mm	0.11 in	1 A	UL94 V-0			DIP ZIF (ZIP)	0.1 "	2.54 mm	Polyphenylene Sulfide (PPS) Glass Filled		0.1 in	2.54 mm		Beryllium Copper	Closed Frame	12	2	24	Tin	Through Hole	Solder	200 µin	5.08 µm	5.08 µm	200 µin	Beryllium Copper	0.6 " (15.24mm) Row Spacing
Aries Electronics 24-6553-11	2.78 mm	0.11 in	1 A	UL94 V-0			DIP ZIF (ZIP)	0.1 "	2.54 mm	Polyphenylene Sulfide (PPS) Glass Filled		0.1 in	2.54 mm	Gold	Beryllium Copper	Closed Frame	12	2	24	Gold	Through Hole	Solder					Beryllium Copper	0.6 " (15.24mm) Row Spacing
Aries Electronics 24-6552-11	2.78 mm	0.11 in	1 A	UL94 V-0			DIP ZIF (ZIP)	0.1 "	2.54 mm	Polyphenylene Sulfide (PPS) Glass Filled		0.1 in	2.54 mm	Gold	Beryllium Copper	Closed Frame	12	2	24	Gold	Through Hole	Solder					Beryllium Copper	0.6 " (15.24mm) Row Spacing
Aries Electronics 24-6556-11	3.3 mm	0.13 in	3 A	UL94 V-0	15.24 mm	0.6 in	DIP	0.1 "	2.54 mm	Polyphenylene Sulfide (PPS) Glass Filled	Brass	0.1 in	2.54 mm	Gold	Beryllium Copper	Open Frame	12	2	24	Gold	Through Hole	Solder	10 Áin	0.25 çm	0.76 Ám	30 Áin
Aries Electronics 24-6554-10	2.78 mm	0.11 in	1 A	UL94 V-0			DIP ZIF (ZIP)	0.1 "	2.54 mm	Polyphenylene Sulfide (PPS) Glass Filled		0.1 in	2.54 mm		Beryllium Copper	Closed Frame	12	2	24	Tin	Through Hole	Solder	200 µin	5.08 µm	5.08 µm	200 µin	Beryllium Copper	0.6 " (15.24mm) Row Spacing
Aries Electronics 24-6553-16	2.78 mm	0.11 in	1 A	UL94 V-0			DIP ZIF (ZIP)	0.1 "	2.54 mm	Polyphenylene Sulfide (PPS) Glass Filled		0.1 in	2.54 mm	Nickel Boron	Beryllium Copper	Closed Frame	12	2	24	Nickel Boron	Through Hole	Solder	50 µin	1.27 µm	1.27 µm	50 µin	Beryllium Copper	0.6 " (15.24mm) Row Spacing
Aries Electronics 24-6556-30	10.74 mm	0.423 in	3 A	UL94 V-0	15.24 mm	0.6 in	DIP	0.1 "	2.54 mm	Polyphenylene Sulfide (PPS) Glass Filled	Brass	0.1 in	2.54 mm	Gold	Beryllium Copper	Open Frame	12	2	24	Tin	Through Hole	Wire Wrap	200 µin	5.08 µm	0.76 Ám	30 Áin