625-60 Series
Manufacturer: Wakefield Thermal Solutions
HEATSINK FOR 25MM BGA
| Part | Package Cooled | Thermal Resistance @ Forced Air Flow | Fin Height | Fin Height | Shape | Attachment Method | Type | Width [x] | Width [x] | Material Finish | Material | Length | Length [x] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Wakefield Thermal Solutions | BGA | 8 °C/W | 15.24 mm | 0.6 in | Pin Fins Square | Thermal Tape Adhesive (Included) | Top Mount | 25 mm | 0.984 " | Black Anodized | Aluminum | 25 mm | 0.984 in |
Wakefield Thermal Solutions | BGA | 8 °C/W | 15.24 mm | 0.6 in | Pin Fins Square | Thermal Tape Adhesive | Top Mount | 25 mm | 0.984 " | Black Anodized | Aluminum | 25 mm | 0.984 in |
Wakefield Thermal Solutions | BGA | 8 °C/W | 15.24 mm | 0.6 in | Pin Fins Square | Thermal Tape Adhesive (Included) | Top Mount | 25 mm | 0.984 " | Black Anodized | Aluminum | 25 mm | 0.984 in |
Wakefield Thermal Solutions | BGA | 8 °C/W | 15.24 mm | 0.6 in | Pin Fins Square | Thermal Tape Adhesive (Included) | Top Mount | 25 mm | 0.984 " | Black Anodized | Aluminum | 25 mm | 0.984 in |