100-PLS Series
Manufacturer: Aries Electronics
Beta
⌘K
CONN SOCKET PGA ZIF GOLD
| Part | Current Rating (Amps) | Material Flammability Rating | Termination Post Length | Termination Post Length | Features | Type | Pitch - Mating | Pitch - Mating | Termination | Operating Temperature [Min] | Operating Temperature [Max] | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Finish - Post | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Mounting Type | Contact Finish - Mating | Pitch - Post | Pitch - Post | Contact Material - Mating | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Aries Electronics | 1 A | UL94 V-0 | 0.125 in | 3.18 mm | Closed Frame | PGA ZIF (ZIP) | 0.1 " | 2.54 mm | Solder | -65 ░C | 125 °C | 200 µin | 5.08 µm | Tin | 0.76 Ám | 30 Áin | Through Hole | Gold | 0.1 in | 2.54 mm | Beryllium Copper | Beryllium Copper |
 Aries Electronics | 1 A | UL94 V-0 | 0.125 in | 3.18 mm | Closed Frame | PGA ZIF (ZIP) | 0.1 " | 2.54 mm | Solder | -65 ░C | 125 °C | 200 µin | 5.08 µm | Tin | 0.76 Ám | 30 Áin | Through Hole | Gold | 0.1 in | 2.54 mm | Beryllium Copper | Beryllium Copper |
Aries Electronics | 1 A | UL94 V-0 | 0.125 in | 3.18 mm | Closed Frame | PGA ZIF (ZIP) | 0.1 " | 2.54 mm | Solder | -65 ░C | 125 °C | 200 µin | 5.08 µm | Tin | 0.76 Ám | 30 Áin | Through Hole | Gold | 0.1 in | 2.54 mm | Beryllium Copper | Beryllium Copper |