10-1508 Series
Manufacturer: Aries Electronics
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⌘K
CONN IC DIP SOCKET 10POS GOLD
| Part | Current Rating (Amps) | Termination Post Length | Termination Post Length | Material Flammability Rating | Number of Positions or Pins (Grid) [y] | Number of Positions or Pins (Grid) | Number of Positions or Pins (Grid) [x] | Housing Material | Operating Temperature [Min] | Operating Temperature [Max] | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Material - Post [custom] | Termination | Contact Material - Mating | Features | Contact Finish - Post | Contact Finish - Mating | Mounting Type | Pitch - Post | Pitch - Post | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Type | Type | Pitch - Mating | Pitch - Mating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Aries Electronics | 3 A | 9.14 mm | 0.36 in | UL94 V-0 | 5 | 10 | 2 | Polyamide (PA46) Nylon 4/6 | -55 C | 105 ░C | 200 µin | 5.08 µm | Brass | Wire Wrap | Beryllium Copper | Closed Frame | Tin | Gold | Through Hole | 0.1 in | 2.54 mm | 0.25 µm | 10 µin | DIP | 5.08 mm | 0.1 " | 2.54 mm |
Aries Electronics | 3 A | 9.14 mm | 0.36 in | UL94 V-0 | 5 | 10 | 2 | Polyamide (PA46) Nylon 4/6 | -55 C | 125 °C | 10 Áin | 0.25 çm | Brass | Wire Wrap | Beryllium Copper | Closed Frame | Gold | Gold | Through Hole | 0.1 in | 2.54 mm | 0.25 µm | 10 µin | DIP | 5.08 mm | 0.1 " | 2.54 mm |