32-3551 Series

Catalog

CONN IC DIP SOCKET ZIF 32POS

Part	Material Flammability Rating	Current Rating (Amps)	Termination Post Length	Termination Post Length	Contact Material - Mating	Pitch - Post	Pitch - Post	Contact Finish - Post	Housing Material	Termination	Mounting Type	Type	Type	Type	Number of Positions or Pins (Grid)	Pitch - Mating	Pitch - Mating	Features	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Material - Post	Contact Finish - Mating	Operating Temperature [Min]	Operating Temperature [Max]
Aries Electronics 32-3551-16	UL94 V-0	1 A	0.11 in	2.78 mm	Beryllium Copper	0.1 in	2.54 mm	Nickel Boron	Polyphenylene Sulfide (PPS) Glass Filled	Solder	Through Hole	DIP ZIF (ZIP)	7.62 mm	0.3 in	32	0.1 "	2.54 mm	Closed Frame	50 µin	1.27 µm	1.27 µm	50 µin	Beryllium Copper	Nickel Boron
Aries Electronics 32-3551-10	UL94 V-0	1 A	0.11 in	2.78 mm	Beryllium Copper	0.1 in	2.54 mm	Tin	Polyphenylene Sulfide (PPS) Glass Filled	Solder	Through Hole	DIP ZIF (ZIP)	7.62 mm	0.3 in	32	0.1 "	2.54 mm	Closed Frame	200 µin	5.08 µm	5.08 µm	200 µin	Beryllium Copper
Aries Electronics 32-3551-11	UL94 V-0	1 A	0.11 in	2.78 mm	Beryllium Copper	0.1 in	2.54 mm	Gold	Polyphenylene Sulfide (PPS) Glass Filled	Solder	Through Hole	DIP ZIF (ZIP)	7.62 mm	0.3 in	32	0.1 "	2.54 mm	Closed Frame					Beryllium Copper	Gold
Aries Electronics 32-3551-18	UL94 V-0	1 A	0.11 in	2.78 mm	Beryllium Nickel	0.1 in	2.54 mm	Nickel Boron	Polyetheretherketone (PEEK) Glass Filled	Solder	Through Hole	DIP ZIF (ZIP)	7.62 mm	0.3 in	32	0.1 "	2.54 mm	Closed Frame	50 µin	1.27 µm	1.27 µm	50 µin	Beryllium Nickel	Nickel Boron	-55 C	250 °C