22-3513 Series

Catalog

CONN IC DIP SOCKET 22POS GOLD

Part	Material Flammability Rating	Current Rating (Amps)	Termination Post Length	Termination Post Length	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Features	Contact Material - Mating	Type	Type	Type	Pitch - Mating	Pitch - Mating	Number of Positions or Pins (Grid) [y]	Number of Positions or Pins (Grid)	Number of Positions or Pins (Grid) [x]	Operating Temperature [Min]	Operating Temperature [Max]	Contact Material - Post [custom]	Housing Material	Pitch - Post	Pitch - Post	Termination	Contact Finish - Mating	Mounting Type	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Finish - Post
Aries Electronics 22-3513-11	UL94 V-0	3 A	0.125 in	3.18 mm	0.25 µm	10 µin	Closed Frame	Beryllium Copper	7.62 mm	0.3 in	DIP	0.1 "	2.54 mm	11	22	2	-55 C	105 ░C	Brass	Polyamide (PA46) Nylon 4/6 Glass Filled	0.1 in	2.54 mm	Solder	Gold	Through Hole	10 Áin	0.25 çm	Gold
Aries Electronics 22-3513-10H	UL94 V-0	3 A	0.125 in	3.18 mm	0.25 µm	10 µin	Closed Frame	Beryllium Copper	7.62 mm	0.3 in	DIP	0.1 "	2.54 mm	11	22	2	-55 C	105 ░C	Brass	Polyamide (PA46) Nylon 4/6 Glass Filled	0.1 in	2.54 mm	Solder	Gold	Through Hole	200 µin	5.08 µm	Tin
Aries Electronics 22-3513-10	UL94 V-0	3 A	0.125 in	3.18 mm	0.25 µm	10 µin	Closed Frame	Beryllium Copper	7.62 mm	0.3 in	DIP	0.1 "	2.54 mm	11	22	2	-55 C	105 ░C	Brass	Polyamide (PA46) Nylon 4/6 Glass Filled	0.1 in	2.54 mm	Solder	Gold	Through Hole	200 µin	5.08 µm	Tin
Aries Electronics 22-3513-10T	UL94 V-0	3 A	0.125 in	3.18 mm	0.25 µm	10 µin	Closed Frame	Beryllium Copper	7.62 mm	0.3 in	DIP	0.1 "	2.54 mm	11	22	2	-55 C	105 ░C	Brass	Polyamide (PA46) Nylon 4/6 Glass Filled	0.1 in	2.54 mm	Solder	Gold	Through Hole	200 µin	5.08 µm	Tin