24-1518 Series

Catalog

CONN IC DIP SOCKET 24POS GOLD

Part	Termination Post Length	Termination Post Length	Material Flammability Rating	Current Rating (Amps)	Contact Finish - Mating	Housing Material	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Finish - Post	Type	Type	Contact Material - Post [custom]	Number of Positions or Pins (Grid) [x]	Number of Positions or Pins (Grid) [y]	Number of Positions or Pins (Grid)	Pitch - Mating	Pitch - Mating	Termination	Mounting Type	Features	Contact Material - Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Pitch - Post	Pitch - Post
Aries Electronics 24-1518-10	0.125 in	3.18 mm	UL94 V-0	3 A	Gold	Polyamide (PA46) Nylon 4/6 Glass Filled	200 µin	5.08 µm	Tin	DIP	5.08 mm	Brass	12	2	24	0.1 "	2.54 mm	Solder	Through Hole	Open Frame	Beryllium Copper	0.25 µm	10 µin	0.1 in	2.54 mm
Aries Electronics 24-1518-00	0.125 in	3.18 mm	UL94 V-0	3 A	Gold	Polyamide (PA46) Nylon 4/6 Glass Filled	200 µin	5.08 µm	Tin	DIP	5.08 mm	Brass	12	2	24	0.1 "	2.54 mm	Solder	Surface Mount	Open Frame	Beryllium Copper	0.25 µm	10 µin	0.1 in	2.54 mm
Aries Electronics 24-1518-11H	0.125 in	3.18 mm	UL94 V-0	3 A	Gold	Polyamide (PA46) Nylon 4/6 Glass Filled	10 Áin	0.25 çm	Gold	DIP	5.08 mm	Brass	12	2	24	0.1 "	2.54 mm	Solder	Through Hole	Open Frame	Beryllium Copper	0.25 µm	10 µin	0.1 in	2.54 mm
Aries Electronics 24-1518-11	0.125 in	3.18 mm	UL94 V-0	3 A	Gold	Polyamide (PA46) Nylon 4/6 Glass Filled	10 Áin	0.25 çm	Gold	DIP	5.08 mm	Brass	12	2	24	0.1 "	2.54 mm	Solder	Through Hole	Open Frame	Beryllium Copper	0.25 µm	10 µin	0.1 in	2.54 mm
Aries Electronics 24-1518-10T	0.125 in	3.18 mm	UL94 V-0	3 A	Gold	Polyamide (PA46) Nylon 4/6 Glass Filled	200 µin	5.08 µm	Tin	DIP	5.08 mm	Brass	12	2	24	0.1 "	2.54 mm	Solder	Through Hole	Open Frame	Beryllium Copper	0.25 µm	10 µin	0.1 in	2.54 mm