628-20 Series

Manufacturer: Wakefield Thermal Solutions

Catalog

HEATSINK FOR 45MM BGA

Part	Attachment Method	Length	Length	Material Finish	Width [x]	Width [x]	Thermal Resistance @ Forced Air Flow	Type	Package Cooled	Material	Shape	Power Dissipation @ Temperature Rise	Fin Height	Fin Height
Wakefield Thermal Solutions 628-20ABT3	Thermal Tape Adhesive (Included)	1.75 in	44.45 mm	Black Anodized	1.7 in	43.18 mm	8 °C/W	Top Mount	ASIC BGA CPU LGA	Aluminum	Pin Fins Square	4 W	0.2 in	5.08 mm
Wakefield Thermal Solutions 628-20AB	Thermal Tape Adhesive (Included)	1.75 in	44.45 mm	Black Anodized	1.7 in	43.18 mm	8 °C/W	Top Mount	ASIC BGA CPU LGA	Aluminum	Pin Fins Square	4 W	0.2 in	5.08 mm
Wakefield Thermal Solutions 628-20ABT3	Thermal Tape Adhesive (Included)	1.75 in	44.45 mm	Black Anodized	1.7 in	43.18 mm	8 °C/W	Top Mount	ASIC BGA CPU LGA	Aluminum	Pin Fins Square	4 W	0.2 in	5.08 mm
Wakefield Thermal Solutions 628-20ABT5	Thermal Tape Adhesive (Included)	1.75 in	44.45 mm	Black Anodized	1.7 in	43.18 mm	8 °C/W	Top Mount	ASIC BGA CPU LGA	Aluminum	Pin Fins Square	4 W	0.2 in	5.08 mm
Wakefield Thermal Solutions 628-20ABT5	Thermal Tape Adhesive (Included)	1.75 in	44.45 mm	Black Anodized	1.7 in	43.18 mm	8 °C/W	Top Mount	ASIC BGA CPU LGA	Aluminum	Pin Fins Square	4 W	0.2 in	5.08 mm
Wakefield Thermal Solutions 628-20ABT1E	Thermal Tape Adhesive (Included)	1.75 in	44.45 mm	Black Anodized	1.7 in	43.18 mm	8 °C/W	Top Mount	ASIC BGA CPU LGA	Aluminum	Pin Fins Square	4 W	0.2 in	5.08 mm
Wakefield Thermal Solutions 628-20ABT1E	Thermal Tape Adhesive (Included)	1.75 in	44.45 mm	Black Anodized	1.7 in	43.18 mm	8 °C/W	Top Mount	ASIC BGA CPU LGA	Aluminum	Pin Fins Square	4 W	0.2 in	5.08 mm
Wakefield Thermal Solutions 628-20AB	Thermal Tape Adhesive (Included)	1.75 in	44.45 mm	Black Anodized	1.7 in	43.18 mm	8 °C/W	Top Mount	ASIC BGA CPU LGA	Aluminum	Pin Fins Square	4 W	0.2 in	5.08 mm