40-6551 Series

Catalog

CONN IC DIP SOCKET ZIF 40POS TIN

Part	Material Flammability Rating	Current Rating (Amps)	Termination Post Length	Termination Post Length	Mounting Type	Features	Pitch - Mating	Pitch - Mating	Number of Positions or Pins (Grid)	Contact Material - Post	Termination	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Type	Type	Contact Finish - Post	Housing Material	Pitch - Post	Pitch - Post	Contact Finish - Mating	Operating Temperature [Min]	Operating Temperature [Max]
Aries Electronics 40-6551-10	UL94 V-0	1 A	0.11 in	2.78 mm	Through Hole	Closed Frame	0.1 "	2.54 mm	40	Beryllium Copper	Solder	5.08 µm	200 µin	Beryllium Copper	200 µin	5.08 µm	DIP ZIF (ZIP)	0.6 " (15.24mm) Row Spacing	Tin	Polyphenylene Sulfide (PPS) Glass Filled	0.1 in	2.54 mm
Aries Electronics 40-6551-18	UL94 V-0	1 A	0.11 in	2.78 mm	Through Hole	Closed Frame	0.1 "	2.54 mm	40	Beryllium Nickel	Solder	1.27 µm	50 µin	Beryllium Nickel	50 µin	1.27 µm	DIP ZIF (ZIP)	0.6 " (15.24mm) Row Spacing	Nickel Boron	Polyetheretherketone (PEEK) Glass Filled	0.1 in	2.54 mm	Nickel Boron	-55 C	250 °C
Aries Electronics 40-6551-11	UL94 V-0	1 A	0.11 in	2.78 mm	Through Hole	Closed Frame	0.1 "	2.54 mm	40	Beryllium Copper	Solder			Beryllium Copper			DIP ZIF (ZIP)	0.6 " (15.24mm) Row Spacing	Gold	Polyphenylene Sulfide (PPS) Glass Filled	0.1 in	2.54 mm	Gold