40-3574 Series

Catalog

CONN IC DIP SOCKET ZIF 40POS GLD

Part	Current Rating (Amps)	Termination Post Length	Termination Post Length	Material Flammability Rating	Contact Material - Post	Number of Positions or Pins (Grid)	Contact Material - Mating	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Housing Material	Contact Finish - Post	Termination	Contact Finish - Mating	Mounting Type	Pitch - Post	Pitch - Post	Pitch - Mating	Pitch - Mating	Type	Type	Type	Features
Aries Electronics 40-3574-18	1 A	0.11 in	2.78 mm	UL94 V-0	Beryllium Copper	40	Beryllium Copper	10 Áin	0.25 çm	0.25 µm	10 µin	Polyphenylene Sulfide (PPS) Glass Filled	Gold	Solder	Gold	Through Hole	0.1 in	2.54 mm	0.1 "	2.54 mm	DIP ZIF (ZIP)	7.62 mm	0.3 in	Closed Frame
Aries Electronics 40-3574-11	1 A	0.11 in	2.78 mm	UL94 V-0	Beryllium Copper	40	Beryllium Copper	10 Áin	0.25 çm	0.25 µm	10 µin	Polyphenylene Sulfide (PPS) Glass Filled	Gold	Solder	Gold	Through Hole	0.1 in	2.54 mm	0.1 "	2.54 mm	DIP ZIF (ZIP)	7.62 mm	0.3 in	Closed Frame
Aries Electronics 40-3574-16	1 A	0.11 in	2.78 mm	UL94 V-0	Beryllium Copper	40	Beryllium Copper	10 Áin	0.25 çm	0.25 µm	10 µin	Polyphenylene Sulfide (PPS) Glass Filled	Gold	Solder	Gold	Through Hole	0.1 in	2.54 mm	0.1 "	2.54 mm	DIP ZIF (ZIP)	7.62 mm	0.3 in	Closed Frame