50-9503 Series
Manufacturer: Aries Electronics
CONN IC DIP SOCKET 50POS GOLD
| Part | Current Rating (Amps) | Termination Post Length | Termination Post Length | Material Flammability Rating | Pitch - Post | Pitch - Post | Contact Material - Post | Type | Type | Type | Operating Temperature [Min] | Operating Temperature [Max] | Contact Finish - Post | Contact Finish - Mating | Termination | Mounting Type | Pitch - Mating | Pitch - Mating | Features | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Material - Mating | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Number of Positions or Pins (Grid) [x] | Number of Positions or Pins (Grid) [custom] | Number of Positions or Pins (Grid) [y] | Housing Material |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | 3 A | 0.5 in | 12.7 mm | UL94 V-0 | 0.1 in | 2.54 mm | Phosphor Bronze | DIP | 22.86 mm | 0.9 in | -55 C | 125 °C | Gold | Gold | Wire Wrap | Through Hole | 0.1 " | 2.54 mm | Closed Frame | 10 Áin | 0.25 çm | Beryllium Copper | 0.25 µm | 10 µin | 2 | 50 | 25 | Polyamide (PA46) Nylon 4/6 Glass Filled |
Aries Electronics | 3 A | 0.36 in | 9.14 mm | UL94 V-0 | 0.1 in | 2.54 mm | Phosphor Bronze | DIP | 22.86 mm | 0.9 in | -55 C | 125 °C | Gold | Gold | Wire Wrap | Through Hole | 0.1 " | 2.54 mm | Closed Frame | 10 Áin | 0.25 çm | Beryllium Copper | 0.25 µm | 10 µin | 2 | 50 | 25 | Polyamide (PA46) Nylon 4/6 Glass Filled |
Aries Electronics | 3 A | 0.5 in | 12.7 mm | UL94 V-0 | 0.1 in | 2.54 mm | Phosphor Bronze | DIP | 22.86 mm | 0.9 in | -55 C | 105 ░C | Tin | Gold | Wire Wrap | Through Hole | 0.1 " | 2.54 mm | Closed Frame | 200 µin | 5.08 µm | Beryllium Copper | 0.25 µm | 10 µin | 2 | 50 | 25 | Polyamide (PA46) Nylon 4/6 Glass Filled |