ADSP-BF702 Series

Low Power 400MHzBlackfin+ Embedded Processor with 256KByte L2 SRAM

Catalog

Low Power 400MHzBlackfin+ Embedded Processor with 256KByte L2 SRAM

Part	Voltage - I/O	On-Chip RAM	Type	Supplier Device Package	Clock Rate	Operating Temperature [Max]	Operating Temperature [Min]	Mounting Type	Package / Case	Interface	Non-Volatile Memory	Voltage - Core
Analog Devices ADSP-BF702BCPZ-3	1.8 V 3.3 V	2 Mbit	Blackfin+	88-LFCSP-VQ (12x12)	300 MHz	85 °C	-40 °C	Surface Mount	88-VFQFN Exposed Pad CSP	CAN DSPI EBI/EMI I2C PPI QSPI SD/SDIO SPI SPORT UART/USART USB OTG	512 kB	1.1 V

Catalog

Low Power 400MHzBlackfin+ Embedded Processor with 256KByte L2 SRAM

Key Features

• Blackfin+ core with up to 400 MHz performanceDual 16-bit or single 32-bit MAC support per cycle16-bit complex MAC and many other instruction set enhancementsInstruction set compatible with previous Blackfin product

• Dual 16-bit or single 32-bit MAC support per cycle

• 16-bit complex MAC and many other instruction set enhancements

• Instruction set compatible with previous Blackfin product

• On-Chip Memory136KB L1 SRAM with multi-parity-bit protection (64KB instruction, 64KB data, 8KB scratchpad)256KByte on-chip L2 SRAM with ECC protection512KByte On-chip L2 ROM

• 136KB L1 SRAM with multi-parity-bit protection (64KB instruction, 64KB data, 8KB scratchpad)

• 256KByte on-chip L2 SRAM with ECC protection

• 512KByte On-chip L2 ROM

• Key Peripherals includeUSB2.0 HS OTG2x CAN2.0BePPI Video I/O2x SPORTs (w/I2S)2xQuad-SPI / 1xDual-SPI (w/ Host mode option)I2C2xUARTSD/SDIO/MMC (4-bit)

• USB2.0 HS OTG

• 2x CAN2.0B

• ePPI Video I/O

• 2x SPORTs (w/I2S)

• 2xQuad-SPI / 1xDual-SPI (w/ Host mode option)

• I2C

• 2xUART

• SD/SDIO/MMC (4-bit)

• Security and one-time-programmable memoryCrypto hardware accelerators for fast secure boot/IP protectionmemDMA encryption/decryption for fast run-time security

• Crypto hardware accelerators for fast secure boot/IP protection

• memDMA encryption/decryption for fast run-time security

• Low-cost packaging88-Lead LFCSP (QFN) package (12 mm × 12mm), RoHS compliant

• 88-Lead LFCSP (QFN) package (12 mm × 12mm), RoHS compliant

• Low system power with < 100 mW at 400 MHz (< 0.25 mW/MHz) at 25°C TJUNCTION

Description

This device is a member of the ADSP-BF70x Blackfin Digital Signal Processor (DSP) product family. The new Blackfin+ processor core combines dual-MAC 16-bit, 32-bit MAC and 16-bit complex MAC in to a state-of-the-art signal processing engine. It also combines advantages of a clean, orthogonal RISC-like microprocessor instruction set, and single-instruction, multiple-data (SIMD) multimedia capabilities within a single instruction-set architecture. Further new enhancements to the Blackfin+ core add cache enhancements, branch prediction and other instruction set improvements—all while maintaining instruction set compatibility to previous Blackfin products.The processor offers performance up to 400 MHz, as well as lowest power consumption at <100mW. Produced with a low-power and low-voltage design methodology, they provide world-class power management and performance.By integrating a rich set of industry-leading system peripherals and large on-chip memory, this Blackfin processor is the platform of choice for next-generation applications that require RISC-like programmability, multimedia support, and leading-edge signal processing in one integrated package. These applications span a wide array of markets, from automotive systems to embedded industrial, instrumentation, video/image analysis, biometric and control applications.