24-3574 Series

Catalog

CONN IC DIP SOCKET ZIF 24POS TIN

Part	Material Flammability Rating	Current Rating (Amps)	Termination Post Length	Termination Post Length	Pitch - Mating	Pitch - Mating	Termination	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Pitch - Post	Pitch - Post	Housing Material	Type	Type	Type	Contact Material - Post	Number of Positions or Pins (Grid) [x]	Number of Positions or Pins (Grid) [y]	Number of Positions or Pins (Grid)	Contact Finish - Post	Contact Material - Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Mounting Type	Features
Aries Electronics 24-3574-11	UL94 V-0	1 A	0.11 in	2.78 mm	0.1 "	2.54 mm	Solder	200 µin	5.08 µm	0.1 in	2.54 mm	Polyphenylene Sulfide (PPS) Glass Filled	DIP ZIF (ZIP)	7.62 mm	0.3 in	Beryllium Copper	12	2	24	Tin	Beryllium Copper	5.08 µm	200 µin	Through Hole	Closed Frame
Aries Electronics 24-3574-16	UL94 V-0	1 A	0.11 in	2.78 mm	0.1 "	2.54 mm	Solder	200 µin	5.08 µm	0.1 in	2.54 mm	Polyphenylene Sulfide (PPS) Glass Filled	DIP ZIF (ZIP)	7.62 mm	0.3 in	Beryllium Copper	12	2	24	Tin	Beryllium Copper	5.08 µm	200 µin	Through Hole	Closed Frame
Aries Electronics 24-3574-10	UL94 V-0	1 A	0.11 in	2.78 mm	0.1 "	2.54 mm	Solder	200 µin	5.08 µm	0.1 in	2.54 mm	Polyphenylene Sulfide (PPS) Glass Filled	DIP ZIF (ZIP)	7.62 mm	0.3 in	Beryllium Copper	12	2	24	Tin	Beryllium Copper	5.08 µm	200 µin	Through Hole	Closed Frame