28-3552 Series

Catalog

CONN IC DIP SOCKET ZIF 28POS

Part	Material Flammability Rating	Current Rating (Amps)	Termination Post Length	Termination Post Length	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Number of Positions or Pins (Grid)	Contact Material - Mating	Mounting Type	Termination	Contact Finish - Post	Housing Material	Pitch - Mating	Pitch - Mating	Operating Temperature [Min]	Operating Temperature [Max]	Pitch - Post	Pitch - Post	Features	Type	Type	Type	Contact Material - Post	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Finish - Mating
Aries Electronics 28-3552-18	UL94 V-0	1 A	0.11 in	2.78 mm	1.27 µm	50 µin	28	Beryllium Nickel	Through Hole	Solder	Nickel Boron	Polyetheretherketone (PEEK) Glass Filled	0.1 "	2.54 mm	-55 C	250 °C	0.1 in	2.54 mm	Closed Frame	DIP ZIF (ZIP)	7.62 mm	0.3 in	Beryllium Nickel	50 µin	1.27 µm	Nickel Boron
Aries Electronics 28-3552-16	UL94 V-0	1 A	0.11 in	2.78 mm	1.27 µm	50 µin	28	Beryllium Copper	Through Hole	Solder	Nickel Boron	Polyphenylene Sulfide (PPS) Glass Filled	0.1 "	2.54 mm			0.1 in	2.54 mm	Closed Frame	DIP ZIF (ZIP)	7.62 mm	0.3 in	Beryllium Copper	50 µin	1.27 µm	Nickel Boron