32-C182 Series

Catalog

CONN IC DIP SOCKET 32POS GOLD

Part	Termination Post Length	Termination Post Length	Current Rating (Amps)	Material Flammability Rating	Pitch - Post	Pitch - Post	Termination	Mounting Type	Operating Temperature [Min]	Operating Temperature [Max]	Contact Finish - Post	Contact Material - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Number of Positions or Pins (Grid)	Contact Material - Post [custom]	Pitch - Mating	Pitch - Mating	Type [custom]	Type [custom]	Type	Features	Housing Material	Contact Finish Thickness - Post	Contact Finish Thickness - Post
Aries Electronics 32-C182-11	0.125 in	3.18 mm	3 A	UL94 V-0	0.1 in	2.54 mm	Solder	Through Hole	-55 C	125 °C	Gold	Beryllium Copper	Gold	0.25 µm	10 µin	32	Brass	0.1 "	2.54 mm	15.24 mm	0.6 in	DIP	Closed Frame	Polyamide (PA46) Nylon 4/6 Glass Filled	10 Áin	0.25 çm
Aries Electronics 32-C182-10	0.125 in	3.18 mm	3 A	UL94 V-0	0.1 in	2.54 mm	Solder	Through Hole	-55 C	105 ░C	Tin	Beryllium Copper	Gold	0.25 µm	10 µin	32	Brass	0.1 "	2.54 mm	15.24 mm	0.6 in	DIP	Closed Frame	Polyamide (PA46) Nylon 4/6 Glass Filled	200 µin	5.08 µm
Aries Electronics 32-C182-00	0.04 in	1.02 mm	3 A	UL94 V-0	0.1 in	2.54 mm	Solder	Surface Mount	-55 C	105 ░C	Tin	Beryllium Copper	Gold	0.25 µm	10 µin	32	Brass	0.1 "	2.54 mm	15.24 mm	0.6 in	DIP	Closed Frame	Polyamide (PA46) Nylon 4/6 Glass Filled	200 µin	5.08 µm