28-6513 Series

Catalog

CONN IC DIP SOCKET 28POS GOLD

Part	Current Rating (Amps)	Termination Post Length	Termination Post Length	Material Flammability Rating	Features	Contact Material - Mating	Termination	Housing Material	Contact Finish - Post	Type [custom]	Type [custom]	Type	Pitch - Post	Pitch - Post	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Pitch - Mating	Pitch - Mating	Mounting Type	Number of Positions or Pins (Grid)	Operating Temperature [Min]	Operating Temperature [Max]	Contact Material - Post [custom]	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Finish - Mating
Aries Electronics 28-6513-11	3 A	0.125 in	3.18 mm	UL94 V-0	Closed Frame	Beryllium Copper	Solder	Polyamide (PA46) Nylon 4/6 Glass Filled	Gold	15.24 mm	0.6 in	DIP	0.1 in	2.54 mm	0.25 µm	10 µin	0.1 "	2.54 mm	Through Hole	28	-55 C	105 ░C	Brass	10 Áin	0.25 çm	Gold
Aries Electronics 28-6513-10H	3 A	0.125 in	3.18 mm	UL94 V-0	Closed Frame	Beryllium Copper	Solder	Polyamide (PA46) Nylon 4/6 Glass Filled	Tin	15.24 mm	0.6 in	DIP	0.1 in	2.54 mm	0.25 µm	10 µin	0.1 "	2.54 mm	Through Hole	28	-55 C	105 ░C	Brass	200 µin	5.08 µm	Gold
Aries Electronics 28-6513-10	3 A	0.125 in	3.18 mm	UL94 V-0	Closed Frame	Beryllium Copper	Solder	Polyamide (PA46) Nylon 4/6 Glass Filled	Tin	15.24 mm	0.6 in	DIP	0.1 in	2.54 mm	0.25 µm	10 µin	0.1 "	2.54 mm	Through Hole	28	-55 C	105 ░C	Brass	200 µin	5.08 µm	Gold
Aries Electronics 28-6513-11H	3 A	0.125 in	3.18 mm	UL94 V-0	Closed Frame	Beryllium Copper	Solder	Polyamide (PA46) Nylon 4/6 Glass Filled	Gold	15.24 mm	0.6 in	DIP	0.1 in	2.54 mm	0.25 µm	10 µin	0.1 "	2.54 mm	Through Hole	28	-55 C	105 ░C	Brass	10 Áin	0.25 çm	Gold