48-6571 Series

Catalog

CONN IC DIP SOCKET ZIF 48POS

Part	Current Rating (Amps)	Material Flammability Rating	Termination Post Length	Termination Post Length	Number of Positions or Pins (Grid) [y]	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [x]	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Termination	Contact Finish - Post	Type	Type	Pitch - Post	Pitch - Post	Housing Material	Features	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Material - Post	Contact Material - Mating	Mounting Type	Pitch - Mating	Pitch - Mating	Operating Temperature [Min]	Operating Temperature [Max]
Aries Electronics 48-6571-16	1 A	UL94 V-0	0.11 in	2.78 mm	2	48	24	Nickel Boron	50 µin	1.27 µm	Solder	Nickel Boron	DIP ZIF (ZIP)	0.6 " (15.24mm) Row Spacing	0.1 in	2.54 mm	Polyphenylene Sulfide (PPS) Glass Filled	Closed Frame	1.27 µm	50 µin	Beryllium Nickel	Beryllium Nickel	Through Hole	0.1 "	2.54 mm
Aries Electronics 48-6571-11	1 A	UL94 V-0	0.11 in	2.78 mm	2	48	24	Gold	10 µin	0.25 µm	Solder	Gold	DIP ZIF (ZIP)	0.6 " (15.24mm) Row Spacing	0.1 in	2.54 mm	Polyphenylene Sulfide (PPS) Glass Filled	Closed Frame	0.25 çm	10 Áin	Beryllium Copper	Beryllium Copper	Through Hole	0.1 "	2.54 mm
Aries Electronics 48-6571-18	1 A	UL94 V-0	0.11 in	2.78 mm	2	48	24	Nickel Boron	50 µin	1.27 µm	Solder	Nickel Boron	DIP ZIF (ZIP)	0.6 " (15.24mm) Row Spacing	0.1 in	2.54 mm	Polyetheretherketone (PEEK) Glass Filled	Closed Frame	1.27 µm	50 µin	Beryllium Nickel	Beryllium Nickel	Through Hole	0.1 "	2.54 mm	-55 C	250 °C