64-9503 Series
Manufacturer: Aries Electronics
CONN IC DIP SOCKET 64POS GOLD
| Part | Material Flammability Rating | Termination Post Length | Termination Post Length | Current Rating (Amps) | Housing Material | Pitch - Post | Pitch - Post | Mounting Type | Termination | Operating Temperature [Min] | Operating Temperature [Max] | Contact Material - Mating | Type | Type | Type | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Material - Post | Features | Contact Finish - Mating | Number of Positions or Pins (Grid) [x] | Number of Positions or Pins (Grid) | Number of Positions or Pins (Grid) [y] | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Finish - Post | Pitch - Mating | Pitch - Mating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | UL94 V-0 | 0.5 in | 12.7 mm | 3 A | Polyamide (PA46) Nylon 4/6 Glass Filled | 0.1 in | 2.54 mm | Through Hole | Wire Wrap | -55 C | 125 °C | Beryllium Copper | DIP | 22.86 mm | 0.9 in | 0.25 µm | 10 µin | Phosphor Bronze | Closed Frame | Gold | 2 | 64 | 32 | 10 Áin | 0.25 çm | Gold | 0.1 " | 2.54 mm |
Aries Electronics | UL94 V-0 | 0.36 in | 9.14 mm | 3 A | Polyamide (PA46) Nylon 4/6 Glass Filled | 0.1 in | 2.54 mm | Through Hole | Wire Wrap | -55 C | 125 °C | Beryllium Copper | DIP | 22.86 mm | 0.9 in | 0.25 µm | 10 µin | Phosphor Bronze | Closed Frame | Gold | 2 | 64 | 32 | 10 Áin | 0.25 çm | Gold | 0.1 " | 2.54 mm |
Aries Electronics | UL94 V-0 | 0.36 in | 9.14 mm | 3 A | Polyamide (PA46) Nylon 4/6 Glass Filled | 0.1 in | 2.54 mm | Through Hole | Wire Wrap | -55 C | 105 ░C | Beryllium Copper | DIP | 22.86 mm | 0.9 in | 0.25 µm | 10 µin | Phosphor Bronze | Closed Frame | Gold | 2 | 64 | 32 | 200 µin | 5.08 µm | Tin | 0.1 " | 2.54 mm |