24-3553 Series

Catalog

CONN IC DIP SOCKET ZIF 24POS

Part	Material Flammability Rating	Current Rating (Amps)	Termination Post Length	Termination Post Length	Type	Type	Type	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Housing Material	Operating Temperature [Min]	Operating Temperature [Max]	Pitch - Mating	Pitch - Mating	Contact Finish - Post	Features	Contact Material - Mating	Number of Positions or Pins (Grid) [x]	Number of Positions or Pins (Grid) [y]	Number of Positions or Pins (Grid)	Contact Finish - Mating	Pitch - Post	Pitch - Post	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Material - Post	Mounting Type	Termination
Aries Electronics 24-3553-18	UL94 V-0	1 A	0.11 in	2.78 mm	DIP ZIF (ZIP)	7.62 mm	0.3 in	1.27 µm	50 µin	Polyetheretherketone (PEEK) Glass Filled	-55 C	250 °C	0.1 "	2.54 mm	Nickel Boron	Closed Frame	Beryllium Nickel	12	2	24	Nickel Boron	0.1 in	2.54 mm	50 µin	1.27 µm	Beryllium Nickel	Through Hole	Solder
Aries Electronics 24-3553-16	UL94 V-0	1 A	0.11 in	2.78 mm	DIP ZIF (ZIP)	7.62 mm	0.3 in	1.27 µm	50 µin	Polyphenylene Sulfide (PPS) Glass Filled			0.1 "	2.54 mm	Nickel Boron	Closed Frame	Beryllium Copper	12	2	24	Nickel Boron	0.1 in	2.54 mm	50 µin	1.27 µm	Beryllium Copper	Through Hole	Solder
Aries Electronics 24-3553-10	UL94 V-0	1 A	0.11 in	2.78 mm	DIP ZIF (ZIP)	7.62 mm	0.3 in	5.08 µm	200 µin	Polyphenylene Sulfide (PPS) Glass Filled			0.1 "	2.54 mm	Tin	Closed Frame	Beryllium Copper	12	2	24		0.1 in	2.54 mm	200 µin	5.08 µm	Beryllium Copper	Through Hole	Solder