18-0518 Series

Catalog

CONN SOCKET SIP 18POS GOLD

Part	Current Rating (Amps)	Material Flammability Rating	Termination Post Length	Termination Post Length	Contact Material - Post [custom]	Pitch - Post	Pitch - Post	Type	Pitch - Mating	Pitch - Mating	Features	Housing Material	Contact Material - Mating	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Finish - Post	Termination	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Finish - Mating	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [y]	Number of Positions or Pins (Grid) [x]	Mounting Type
Aries Electronics 18-0518-10H	3 A	UL94 V-0	0.125 in	3.18 mm	Brass	0.1 in	2.54 mm	SIP	0.1 "	2.54 mm	Open Frame	Polyamide (PA46) Nylon 4/6 Glass Filled	Beryllium Copper	200 µin	5.08 µm	Tin	Solder	0.25 µm	10 µin	Gold	18	18	1	Through Hole
Aries Electronics 18-0518-11H	3 A	UL94 V-0	0.125 in	3.18 mm	Brass	0.1 in	2.54 mm	SIP	0.1 "	2.54 mm	Open Frame	Polyamide (PA46) Nylon 4/6 Glass Filled	Beryllium Copper	10 Áin	0.25 çm	Gold	Solder	0.25 µm	10 µin	Gold	18	18	1	Through Hole
Aries Electronics 18-0518-10T	3 A	UL94 V-0	0.125 in	3.18 mm	Brass	0.1 in	2.54 mm	SIP	0.1 "	2.54 mm	Open Frame	Polyamide (PA46) Nylon 4/6 Glass Filled	Beryllium Copper	200 µin	5.08 µm	Tin	Solder	0.25 µm	10 µin	Gold	18	18	1	Through Hole
Aries Electronics 18-0518-10	3 A	UL94 V-0	0.125 in	3.18 mm	Brass	0.1 in	2.54 mm	SIP	0.1 "	2.54 mm	Open Frame	Polyamide (PA46) Nylon 4/6 Glass Filled	Beryllium Copper	200 µin	5.08 µm	Tin	Solder	0.25 µm	10 µin	Gold	18	18	1	Through Hole