28-3551 Series
Manufacturer: Aries Electronics
Beta
⌘K
CONN IC DIP SOCKET ZIF 28POS
| Part | Termination Post Length | Termination Post Length | Material Flammability Rating | Current Rating (Amps) | Type | Type | Type | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Housing Material | Features | Pitch - Mating | Pitch - Mating | Contact Material - Post | Number of Positions or Pins (Grid) | Termination | Contact Material - Mating | Contact Finish - Mating | Pitch - Post | Pitch - Post | Mounting Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Aries Electronics | 0.11 in | 2.78 mm | UL94 V-0 | 1 A | DIP ZIF (ZIP) | 7.62 mm | 0.3 in | 50 µin | 1.27 µm | Nickel Boron | 1.27 µm | 50 µin | Polyphenylene Sulfide (PPS) Glass Filled | Closed Frame | 0.1 " | 2.54 mm | Beryllium Copper | 28 | Solder | Beryllium Copper | Nickel Boron | 0.1 in | 2.54 mm | Through Hole |
Aries Electronics | 0.11 in | 2.78 mm | UL94 V-0 | 1 A | DIP ZIF (ZIP) | 7.62 mm | 0.3 in | 200 µin | 5.08 µm | Tin | 5.08 µm | 200 µin | Polyphenylene Sulfide (PPS) Glass Filled | Closed Frame | 0.1 " | 2.54 mm | Beryllium Copper | 28 | Solder | Beryllium Copper | 0.1 in | 2.54 mm | Through Hole |