40-3503 Series
Manufacturer: Aries Electronics
CONN IC DIP SOCKET 40POS GOLD
| Part | Current Rating (Amps) | Material Flammability Rating | Termination Post Length | Termination Post Length | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Material - Post | Contact Finish - Post | Contact Finish - Mating | Features | Contact Material - Mating | Pitch - Post | Pitch - Post | Operating Temperature [Min] | Operating Temperature [Max] | Housing Material | Type | Type | Type | Pitch - Mating | Pitch - Mating | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Number of Positions or Pins (Grid) | Termination | Mounting Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | 3 A | UL94 V-0 | 9.14 mm | 0.36 in | 0.25 µm | 10 µin | Phosphor Bronze | Gold | Gold | Closed Frame | Beryllium Copper | 0.1 in | 2.54 mm | -55 C | 125 °C | Polyamide (PA46) Nylon 4/6 Glass Filled | 7.62 mm | 0.3 in | DIP | 0.1 " | 2.54 mm | 10 Áin | 0.25 çm | 40 | Wire Wrap | Through Hole |
Aries Electronics | 3 A | UL94 V-0 | 12.7 mm | 0.5 in | 0.25 µm | 10 µin | Phosphor Bronze | Tin | Gold | Closed Frame | Beryllium Copper | 0.1 in | 2.54 mm | -55 C | 105 ░C | Polyamide (PA46) Nylon 4/6 Glass Filled | 7.62 mm | 0.3 in | DIP | 0.1 " | 2.54 mm | 200 µin | 5.08 µm | 40 | Wire Wrap | Through Hole |
Aries Electronics | 3 A | UL94 V-0 | 12.7 mm | 0.5 in | 0.25 µm | 10 µin | Phosphor Bronze | Gold | Gold | Closed Frame | Beryllium Copper | 0.1 in | 2.54 mm | -55 C | 125 °C | Polyamide (PA46) Nylon 4/6 Glass Filled | 7.62 mm | 0.3 in | DIP | 0.1 " | 2.54 mm | 10 Áin | 0.25 çm | 40 | Wire Wrap | Through Hole |