10-2503 Series
Manufacturer: Aries Electronics
CONN IC DIP SOCKET 10POS GOLD
| Part | Material Flammability Rating | Termination Post Length | Termination Post Length | Current Rating (Amps) | Contact Finish - Post | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Pitch - Post | Pitch - Post | Number of Positions or Pins (Grid) [y] | Number of Positions or Pins (Grid) | Number of Positions or Pins (Grid) [x] | Mounting Type | Type | Type | Features | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Finish - Mating | Operating Temperature [Min] | Operating Temperature [Max] | Termination | Pitch - Mating | Pitch - Mating | Housing Material | Contact Material - Post | Contact Material - Mating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | UL94 V-0 | 0.5 in | 12.7 mm | 3 A | Tin | 200 µin | 5.08 µm | 0.1 in | 2.54 mm | 5 | 10 | 2 | Through Hole | DIP | 5.08 mm | Closed Frame | 0.25 µm | 10 µin | Gold | -55 C | 105 ░C | Wire Wrap | 0.1 " | 2.54 mm | Polyamide (PA46) Nylon 4/6 Glass Filled | Phosphor Bronze | Beryllium Copper |
Aries Electronics | UL94 V-0 | 0.5 in | 12.7 mm | 3 A | Gold | 10 Áin | 0.25 çm | 0.1 in | 2.54 mm | 5 | 10 | 2 | Through Hole | DIP | 5.08 mm | Closed Frame | 0.25 µm | 10 µin | Gold | -55 C | 125 °C | Wire Wrap | 0.1 " | 2.54 mm | Polyamide (PA46) Nylon 4/6 Glass Filled | Phosphor Bronze | Beryllium Copper |