28-3570 Series
Manufacturer: Aries Electronics
Beta
⌘K
CONN IC DIP SOCKET ZIF 28POS GLD
| Part | Termination Post Length | Termination Post Length | Current Rating (Amps) | Material Flammability Rating | Type | Type | Type | Termination | Housing Material | Contact Material - Post | Contact Finish - Post | Contact Material - Mating | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Pitch - Mating | Pitch - Mating | Contact Finish - Mating | Pitch - Post | Pitch - Post | Number of Positions or Pins (Grid) | Features | Mounting Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Aries Electronics | 0.11 in | 2.78 mm | 1 A | UL94 V-0 | DIP ZIF (ZIP) | 7.62 mm | 0.3 in | Solder | Polyphenylene Sulfide (PPS) Glass Filled | Beryllium Copper | Gold | Beryllium Copper | 10 Áin | 0.25 çm | 0.25 µm | 10 µin | 0.1 " | 2.54 mm | Gold | 0.1 in | 2.54 mm | 28 | Closed Frame | Through Hole |
Aries Electronics | 0.11 in | 2.78 mm | 1 A | UL94 V-0 | DIP ZIF (ZIP) | 7.62 mm | 0.3 in | Solder | Polyphenylene Sulfide (PPS) Glass Filled | Beryllium Nickel | Nickel Boron | Beryllium Nickel | 50 µin | 1.27 µm | 1.27 µm | 50 µin | 0.1 " | 2.54 mm | Nickel Boron | 0.1 in | 2.54 mm | 28 | Closed Frame | Through Hole |
Aries Electronics | 0.11 in | 2.78 mm | 1 A | UL94 V-0 | DIP ZIF (ZIP) | 7.62 mm | 0.3 in | Solder | Polyphenylene Sulfide (PPS) Glass Filled | Beryllium Copper | Tin | Beryllium Copper | 200 µin | 5.08 µm | 5.08 µm | 200 µin | 0.1 " | 2.54 mm | 0.1 in | 2.54 mm | 28 | Closed Frame | Through Hole |