24-3572 Series
Manufacturer: Aries Electronics
Beta
⌘K
CONN IC DIP SOCKET ZIF 24POS GLD
| Part | Termination Post Length | Termination Post Length | Current Rating (Amps) | Material Flammability Rating | Mounting Type | Pitch - Mating | Pitch - Mating | Number of Positions or Pins (Grid) [x] | Number of Positions or Pins (Grid) [y] | Number of Positions or Pins (Grid) | Contact Material - Mating | Type | Type | Type | Features | Contact Material - Post | Pitch - Post | Pitch - Post | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Finish - Post | Housing Material | Termination | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Finish - Mating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Aries Electronics | 0.11 in | 2.78 mm | 1 A | UL94 V-0 | Through Hole | 0.1 " | 2.54 mm | 12 | 2 | 24 | Beryllium Copper | DIP ZIF (ZIP) | 7.62 mm | 0.3 in | Closed Frame | Beryllium Copper | 0.1 in | 2.54 mm | 10 Áin | 0.25 çm | Gold | Polyphenylene Sulfide (PPS) Glass Filled | Solder | 0.25 µm | 10 µin | Gold |
Aries Electronics | 0.11 in | 2.78 mm | 1 A | UL94 V-0 | Through Hole | 0.1 " | 2.54 mm | 12 | 2 | 24 | Beryllium Nickel | DIP ZIF (ZIP) | 7.62 mm | 0.3 in | Closed Frame | Beryllium Nickel | 0.1 in | 2.54 mm | 50 µin | 1.27 µm | Nickel Boron | Polyphenylene Sulfide (PPS) Glass Filled | Solder | 1.27 µm | 50 µin | Nickel Boron |