
Catalog
Ultra Low Density FPGAs
| Part | Package / Case | Supplier Device Package | Number of I/O | Operating Temperature [Min] | Operating Temperature [Max] | Voltage - Supply [Max] | Voltage - Supply [Min] | Mounting Type | Total RAM Bits |
|---|---|---|---|---|---|---|---|---|---|
Microchip Technology | 484-BGA | 484-FPBGA (23x23) | 341 | 0 °C | 85 °C | 1.575 V | 1.14 V | Surface Mount | 516096 Bits |
Microchip Technology | 896-BGA | 896-FBGA (31x31) | 620 | 0 °C | 85 °C | 1.575 V | 1.425 V | Surface Mount | 516096 Bits |
Microchip Technology | 208-BFQFP | 208-PQFP (28x28) | 147 | -40 C | 100 °C | 1.575 V | 1.14 V | Surface Mount | 516096 Bits |
Microchip Technology | 484-BGA | 484-FPBGA (23x23) | 341 | -40 C | 100 °C | 1.575 V | 1.425 V | Surface Mount | 516096 Bits |
Microchip Technology | 208-BFQFP | 208-PQFP (28x28) | 147 | 0 °C | 85 °C | 1.575 V | 1.14 V | Surface Mount | 516096 Bits |
Microchip Technology | 324-BGA | 324-FBGA (19x19) | 221 | -40 C | 100 °C | 1.575 V | 1.14 V | Surface Mount | 516096 Bits |
Microchip Technology | 484-BGA | 484-FPBGA (23x23) | 341 | -55 °C | 125 ¯C | 1.575 V | 1.425 V | Surface Mount | 516096 Bits |
Microchip Technology | 324-BGA | 324-FBGA (19x19) | 221 | 0 °C | 85 °C | 1.575 V | 1.425 V | Surface Mount | 516096 Bits |
Microchip Technology | 324-BGA | 324-FBGA (19x19) | 221 | -40 C | 100 °C | 1.575 V | 1.425 V | Surface Mount | 516096 Bits |
Microchip Technology | 208-BFQFP | 208-PQFP (28x28) | 147 | -40 C | 100 °C | 1.575 V | 1.425 V | Surface Mount | 516096 Bits |
Key Features
• * 35K logic elements
• * 504Kb RAM
• * 1Kb FlashROM
• * 6 PLL in CCC
• * Temperature - Commercial, Industrial, Military
Description
AI
ProASIC3
offers high performance in ultra low density FPGAs, a single-chip solution,
small footprint packages, reprogrammability, and an abundance of advanced
features.
Key Features
• Low TOC (total cost of ownership)
• 1.2 V to 1.5 V core voltage support
• Innovative Flash\*Freeze technology for instantaneous switching from
active to static mode
• Proven Security
• Protection from Overbuilding and
Cloning
• Exceptional Reliability