18-3540 Series

Catalog

SOCKET ADAPTER DIP TO 18SOIC

Part	Contact Material - Post [custom]	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Current Rating (Amps)	Termination Post Length	Termination Post Length	Contact Material - Mating	Material Flammability Rating	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Number of Pins	Convert From (Adapter End) [custom]	Convert From (Adapter End) [custom]	Convert From (Adapter End)	Convert To (Adapter End)	Termination	Pitch - Post	Pitch - Post	Pitch - Mating	Pitch - Mating	Contact Finish - Post	Mounting Type	Housing Material	Contact Finish - Mating
Aries Electronics 18-354000-11-RC	Brass	0.25 µm	10 µin	3 A	0.03 in	0.76 mm	Beryllium Copper	UL94 V-0	10 Áin	0.25 çm	18	0.3 in	7.62 mm	DIP	SOIC	Solder	0.05 in	1.27 mm	0.1 "	2.54 mm	Gold	Surface Mount	Polyamide (PA46) Nylon 4/6 Glass Filled	Gold
Aries Electronics 18-354000-21-RC	Brass	0.25 µm	10 µin	3 A	0.089 in	2.28 mm	Beryllium Copper	UL94 V-0	10 Áin	0.25 çm	18	0.3 in	7.62 mm	DIP	SOIC	Solder	0.05 in	1.27 mm	0.1 "	2.54 mm	Gold	Surface Mount	Polyamide (PA46) Nylon 4/6 Glass Filled	Gold
Aries Electronics 18-354000-10	Brass	0.25 µm	10 µin	3 A			Beryllium Copper	UL94 V-0	10 Áin	0.25 çm	18	0.3 in	7.62 mm	DIP	SOIC	Solder	0.05 in	1.27 mm	0.1 "	2.54 mm	Gold	Surface Mount	Polyamide (PA46) Nylon 4/6 Glass Filled	Gold