48-6552 Series

Catalog

CONN IC DIP SOCKET ZIF 48POS GLD

Part	Material Flammability Rating	Termination Post Length	Termination Post Length	Current Rating (Amps)	Type	Type	Contact Finish - Mating	Features	Contact Material - Mating	Number of Positions or Pins (Grid) [y]	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [x]	Contact Material - Post	Housing Material	Pitch - Post	Pitch - Post	Termination	Mounting Type	Contact Finish - Post	Pitch - Mating	Pitch - Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Operating Temperature [Min]	Operating Temperature [Max]
Aries Electronics 48-6552-11	UL94 V-0	0.11 in	2.78 mm	1 A	DIP ZIF (ZIP)	0.6 " (15.24mm) Row Spacing	Gold	Closed Frame	Beryllium Copper	2	48	24	Beryllium Copper	Polyphenylene Sulfide (PPS) Glass Filled	0.1 in	2.54 mm	Solder	Through Hole	Gold	0.1 "	2.54 mm
Aries Electronics 48-6552-10	UL94 V-0	0.11 in	2.78 mm	1 A	DIP ZIF (ZIP)	0.6 " (15.24mm) Row Spacing		Closed Frame	Beryllium Copper	2	48	24	Beryllium Copper	Polyphenylene Sulfide (PPS) Glass Filled	0.1 in	2.54 mm	Solder	Through Hole	Tin	0.1 "	2.54 mm	5.08 µm	200 µin	200 µin	5.08 µm
Aries Electronics 48-6552-18	UL94 V-0	0.11 in	2.78 mm	1 A	DIP ZIF (ZIP)	0.6 " (15.24mm) Row Spacing	Nickel Boron	Closed Frame	Beryllium Nickel	2	48	24	Beryllium Nickel	Polyetheretherketone (PEEK) Glass Filled	0.1 in	2.54 mm	Solder	Through Hole	Nickel Boron	0.1 "	2.54 mm	1.27 µm	50 µin	50 µin	1.27 µm	-55 C	250 °C