32-3571 Series

Catalog

CONN IC DIP SOCKET ZIF 32POS GLD

Part	Termination Post Length	Termination Post Length	Material Flammability Rating	Current Rating (Amps)	Contact Finish - Mating	Pitch - Mating	Pitch - Mating	Type	Type	Type	Contact Material - Mating	Housing Material	Contact Finish - Post	Contact Material - Post	Termination	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Mounting Type	Features	Number of Positions or Pins (Grid)	Pitch - Post	Pitch - Post	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating
Aries Electronics 32-3571-11	0.11 in	2.78 mm	UL94 V-0	1 A	Gold	0.1 "	2.54 mm	DIP ZIF (ZIP)	7.62 mm	0.3 in	Beryllium Copper	Polyphenylene Sulfide (PPS) Glass Filled	Gold	Beryllium Copper	Solder	10 Áin	0.25 çm	Through Hole	Closed Frame	32	0.1 in	2.54 mm	0.25 µm	10 µin
Aries Electronics 32-3571-10	0.11 in	2.78 mm	UL94 V-0	1 A		0.1 "	2.54 mm	DIP ZIF (ZIP)	7.62 mm	0.3 in	Beryllium Copper	Polyphenylene Sulfide (PPS) Glass Filled	Tin	Beryllium Copper	Solder	200 µin	5.08 µm	Through Hole	Closed Frame	32	0.1 in	2.54 mm	5.08 µm	200 µin
Aries Electronics 32-3571-16	0.11 in	2.78 mm	UL94 V-0	1 A	Nickel Boron	0.1 "	2.54 mm	DIP ZIF (ZIP)	7.62 mm	0.3 in	Beryllium Nickel	Polyphenylene Sulfide (PPS) Glass Filled	Nickel Boron	Beryllium Nickel	Solder	50 µin	1.27 µm	Through Hole	Closed Frame	32	0.1 in	2.54 mm	1.27 µm	50 µin