44-6571 Series

Catalog

CONN IC DIP SOCKET ZIF 44POS GLD

Part	Current Rating (Amps)	Material Flammability Rating	Termination Post Length	Termination Post Length	Contact Finish - Mating	Pitch - Post	Pitch - Post	Mounting Type	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Housing Material	Termination	Pitch - Mating	Pitch - Mating	Type	Type	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid)	Contact Material - Post	Features	Contact Finish - Post	Contact Material - Mating
Aries Electronics 44-6571-11	1 A	UL94 V-0	0.11 in	2.78 mm	Gold	0.1 in	2.54 mm	Through Hole	0.25 µm	10 µin	10 Áin	0.25 çm	Polyphenylene Sulfide (PPS) Glass Filled	Solder	0.1 "	2.54 mm	DIP ZIF (ZIP)	0.6 " (15.24mm) Row Spacing	2 22	44	Beryllium Copper	Closed Frame	Gold	Beryllium Copper
Aries Electronics 44-6571-16	1 A	UL94 V-0	0.11 in	2.78 mm	Nickel Boron	0.1 in	2.54 mm	Through Hole	1.27 µm	50 µin	50 µin	1.27 µm	Polyphenylene Sulfide (PPS) Glass Filled	Solder	0.1 "	2.54 mm	DIP ZIF (ZIP)	0.6 " (15.24mm) Row Spacing	2 22	44	Beryllium Nickel	Closed Frame	Nickel Boron	Beryllium Nickel
Aries Electronics 44-6571-10	1 A	UL94 V-0	0.11 in	2.78 mm		0.1 in	2.54 mm	Through Hole	5.08 µm	200 µin	200 µin	5.08 µm	Polyphenylene Sulfide (PPS) Glass Filled	Solder	0.1 "	2.54 mm	DIP ZIF (ZIP)	0.6 " (15.24mm) Row Spacing	2 22	44	Beryllium Copper	Closed Frame	Tin	Beryllium Copper