36-6574 Series
Manufacturer: Aries Electronics
Beta
⌘K
CONN IC DIP SOCKET ZIF 36POS TIN
| Part | Current Rating (Amps) | Termination Post Length | Termination Post Length | Material Flammability Rating | Housing Material | Termination | Mounting Type | Pitch - Post | Pitch - Post | Contact Material - Post | Number of Positions or Pins (Grid) | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Features | Type | Type | Pitch - Mating | Pitch - Mating | Contact Material - Mating | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Finish - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Aries Electronics | 1 A | 0.11 in | 2.78 mm | UL94 V-0 | Polyphenylene Sulfide (PPS) Glass Filled | Solder | Through Hole | 0.1 in | 2.54 mm | Beryllium Copper | 36 | 5.08 µm | 200 µin | Closed Frame | DIP ZIF (ZIP) | 0.6 " (15.24mm) Row Spacing | 0.1 " | 2.54 mm | Beryllium Copper | 200 µin | 5.08 µm | Tin |
Aries Electronics | 1 A | 0.11 in | 2.78 mm | UL94 V-0 | Polyphenylene Sulfide (PPS) Glass Filled | Solder | Through Hole | 0.1 in | 2.54 mm | Beryllium Copper | 36 | 5.08 µm | 200 µin | Closed Frame | DIP ZIF (ZIP) | 0.6 " (15.24mm) Row Spacing | 0.1 " | 2.54 mm | Beryllium Copper | 200 µin | 5.08 µm | Tin |
Aries Electronics | 1 A | 0.11 in | 2.78 mm | UL94 V-0 | Polyphenylene Sulfide (PPS) Glass Filled | Solder | Through Hole | 0.1 in | 2.54 mm | Beryllium Copper | 36 | 5.08 µm | 200 µin | Closed Frame | DIP ZIF (ZIP) | 0.6 " (15.24mm) Row Spacing | 0.1 " | 2.54 mm | Beryllium Copper | 200 µin | 5.08 µm | Tin |