48-3551 Series

Catalog

CONN IC DIP SOCKET ZIF 48POS

Part	Current Rating (Amps)	Material Flammability Rating	Termination Post Length	Termination Post Length	Termination	Contact Finish - Post	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Finish - Mating	Pitch - Post	Pitch - Post	Features	Housing Material	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Material - Mating	Pitch - Mating	Pitch - Mating	Mounting Type	Type	Type	Type	Number of Positions or Pins (Grid) [y]	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [x]	Contact Material - Post	Operating Temperature [Min]	Operating Temperature [Max]
Aries Electronics 48-3551-16	1 A	UL94 V-0	0.11 in	2.78 mm	Solder	Nickel Boron	50 µin	1.27 µm	Nickel Boron	0.1 in	2.54 mm	Closed Frame	Polyphenylene Sulfide (PPS) Glass Filled	1.27 µm	50 µin	Beryllium Copper	0.1 "	2.54 mm	Through Hole	DIP ZIF (ZIP)	7.62 mm	0.3 in	2	48	24	Beryllium Copper
Aries Electronics 48-3551-10	1 A	UL94 V-0	0.11 in	2.78 mm	Solder	Tin	200 µin	5.08 µm		0.1 in	2.54 mm	Closed Frame	Polyphenylene Sulfide (PPS) Glass Filled	5.08 µm	200 µin	Beryllium Copper	0.1 "	2.54 mm	Through Hole	DIP ZIF (ZIP)	7.62 mm	0.3 in	2	48	24	Beryllium Copper
Aries Electronics 48-3551-18	1 A	UL94 V-0	0.11 in	2.78 mm	Solder	Nickel Boron	50 µin	1.27 µm	Nickel Boron	0.1 in	2.54 mm	Closed Frame	Polyetheretherketone (PEEK) Glass Filled	1.27 µm	50 µin	Beryllium Nickel	0.1 "	2.54 mm	Through Hole	DIP ZIF (ZIP)	7.62 mm	0.3 in	2	48	24	Beryllium Nickel	-55 C	250 °C
Aries Electronics 48-3551-11	1 A	UL94 V-0	0.11 in	2.78 mm	Solder	Gold			Gold	0.1 in	2.54 mm	Closed Frame	Polyphenylene Sulfide (PPS) Glass Filled			Beryllium Copper	0.1 "	2.54 mm	Through Hole	DIP ZIF (ZIP)	7.62 mm	0.3 in	2	48	24	Beryllium Copper