19-0518 Series

Catalog

CONN SOCKET SIP 19POS GOLD

Part	Material Flammability Rating	Termination Post Length	Termination Post Length	Current Rating (Amps)	Contact Finish - Mating	Contact Material - Mating	Type	Mounting Type	Pitch - Mating	Pitch - Mating	Contact Material - Post [custom]	Pitch - Post	Pitch - Post	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Termination	Number of Positions or Pins (Grid)	Features	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Finish - Post	Housing Material
Aries Electronics 19-0518-10T	UL94 V-0	0.125 in	3.18 mm	3 A	Gold	Beryllium Copper	SIP	Through Hole	0.1 "	2.54 mm	Brass	0.1 in	2.54 mm	0.25 µm	10 µin	Solder	19	Open Frame	200 µin	5.08 µm	Tin	Polyamide (PA46) Nylon 4/6 Glass Filled
Aries Electronics 19-0518-10H	UL94 V-0	0.125 in	3.18 mm	3 A	Gold	Beryllium Copper	SIP	Through Hole	0.1 "	2.54 mm	Brass	0.1 in	2.54 mm	0.25 µm	10 µin	Solder	19	Open Frame	200 µin	5.08 µm	Tin	Polyamide (PA46) Nylon 4/6 Glass Filled
Aries Electronics 19-0518-11	UL94 V-0	0.125 in	3.18 mm	3 A	Gold	Beryllium Copper	SIP	Through Hole	0.1 "	2.54 mm	Brass	0.1 in	2.54 mm	0.25 µm	10 µin	Solder	19	Open Frame	10 Áin	0.25 çm	Gold	Polyamide (PA46) Nylon 4/6 Glass Filled
Aries Electronics 19-0518-11H	UL94 V-0	0.125 in	3.18 mm	3 A	Gold	Beryllium Copper	SIP	Through Hole	0.1 "	2.54 mm	Brass	0.1 in	2.54 mm	0.25 µm	10 µin	Solder	19	Open Frame	10 Áin	0.25 çm	Gold	Polyamide (PA46) Nylon 4/6 Glass Filled
Aries Electronics 19-0518-10	UL94 V-0	0.125 in	3.18 mm	3 A	Gold	Beryllium Copper	SIP	Through Hole	0.1 "	2.54 mm	Brass	0.1 in	2.54 mm	0.25 µm	10 µin	Solder	19	Open Frame	200 µin	5.08 µm	Tin	Polyamide (PA46) Nylon 4/6 Glass Filled
Aries Electronics 19-0518-00	UL94 V-0	0.046 in	1.17 mm	3 A	Gold	Beryllium Copper	SIP	Surface Mount	0.1 "	2.54 mm	Brass	0.1 in	2.54 mm	0.25 µm	10 µin	Solder	19	Open Frame	200 µin	5.08 µm	Tin	Polyamide (PA46) Nylon 4/6 Glass Filled