42-6552 Series
Manufacturer: Aries Electronics
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⌘K
CONN IC DIP SOCKET ZIF 42POS TIN
| Part | Material Flammability Rating | Current Rating (Amps) | Termination Post Length | Termination Post Length | Housing Material | Number of Positions or Pins (Grid) | Pitch - Mating | Pitch - Mating | Contact Material - Mating | Features | Mounting Type | Contact Finish - Post | Termination | Type | Type | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Pitch - Post | Pitch - Post | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Material - Post | Operating Temperature [Min] | Operating Temperature [Max] | Contact Finish - Mating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Aries Electronics | UL94 V-0 | 1 A | 0.11 in | 2.78 mm | Polyphenylene Sulfide (PPS) Glass Filled | 42 | 0.1 " | 2.54 mm | Beryllium Copper | Closed Frame | Through Hole | Tin | Solder | DIP ZIF (ZIP) | 0.6 " (15.24mm) Row Spacing | 200 µin | 5.08 µm | 0.1 in | 2.54 mm | 5.08 µm | 200 µin | Beryllium Copper | |||
Aries Electronics | UL94 V-0 | 1 A | 0.11 in | 2.78 mm | Polyetheretherketone (PEEK) Glass Filled | 42 | 0.1 " | 2.54 mm | Beryllium Nickel | Closed Frame | Through Hole | Nickel Boron | Solder | DIP ZIF (ZIP) | 0.6 " (15.24mm) Row Spacing | 50 µin | 1.27 µm | 0.1 in | 2.54 mm | 1.27 µm | 50 µin | Beryllium Nickel | -55 C | 250 °C | Nickel Boron |