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Low Density Devices with hard ARM Cortex-M3
Key Features
• Microcontroller Subsystem* Hard 166-MHz 32-Bit ARM Cortex-M3 based SoC FPGA
• * 1.25 DMIPS/MHz
• * 256 KB embedded nonvolatile memory (eNVM)
• * Triple-speed Ethernet (TSE) 10/100/1000 Mbps MAC
• * USB 2.0 high speed on-the-go (OTG) controller
• * 2.0B-compliant CAN controller
• * 64 KB embedded SRAM (eSRAM)
• * Two SPI ports, two I2C ports, and multi-mode UARTs
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• FPGA Fabric* 27.6K logic elements
• * 34 Math blocks (18x18)
• * AES256, SHA256, RNG
• * 6 PLLs and CCCs
• * 592K bits RAM
• * DDR Controller - LPDDR/DDR2/3
• * 4 SERDES Lanes
• * 1 PCIe End Points
• * Offers design security
• * Temperature - Commercial, Industrial, Automotive (T2), Military
Description
AI
These flash FPGA devices are ideal for general purpose functions such as Gigabit Ethernet or dual PCI Express control planes, bridging functions, input/output (I/O) expansion and conversion, video/image processing, system management and secure connectivity. Microchip FPGAs are used by customers in Communications, Industrial, Medical, Defense, and Aviation markets.
More Resources in Low Density Devices
• ARM Cortex-M3 Processor with embedded flash
• Comprehensive microcontroller subsystem
• PCIe Gen2 support
With Clear Advantages
• Lowest Power
• Reduce total power by ~20-40%
• 70mW per 5G SERDES (PCIe Gen2)
• Proven Security
• Protection from Overbuilding and Cloning
• Secure Boot for FPGA & Processors
• Exceptional Reliability
• SEU immune Zero FIT Flash FPGA Configuration
• Reliability safety critical and mission critical systems