32-3572 Series
Manufacturer: Aries Electronics
CONN IC DIP SOCKET ZIF 32POS
| Part | Termination Post Length | Termination Post Length | Current Rating (Amps) | Material Flammability Rating | Type | Type | Type | Pitch - Mating | Pitch - Mating | Termination | Mounting Type | Contact Finish - Mating | Contact Material - Mating | Contact Material - Post | Housing Material | Number of Positions or Pins (Grid) | Pitch - Post | Pitch - Post | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Features | Contact Finish - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | 0.11 in | 2.78 mm | 1 A | UL94 V-0 | DIP ZIF (ZIP) | 7.62 mm | 0.3 in | 0.1 " | 2.54 mm | Solder | Through Hole | Nickel Boron | Beryllium Nickel | Beryllium Nickel | Polyphenylene Sulfide (PPS) Glass Filled | 32 | 0.1 in | 2.54 mm | 50 µin | 1.27 µm | 1.27 µm | 50 µin | Closed Frame | Nickel Boron |
Aries Electronics | 0.11 in | 2.78 mm | 1 A | UL94 V-0 | DIP ZIF (ZIP) | 7.62 mm | 0.3 in | 0.1 " | 2.54 mm | Solder | Through Hole | Beryllium Copper | Beryllium Copper | Polyphenylene Sulfide (PPS) Glass Filled | 32 | 0.1 in | 2.54 mm | 200 µin | 5.08 µm | 5.08 µm | 200 µin | Closed Frame | Tin | |
Aries Electronics | 0.11 in | 2.78 mm | 1 A | UL94 V-0 | DIP ZIF (ZIP) | 7.62 mm | 0.3 in | 0.1 " | 2.54 mm | Solder | Through Hole | Gold | Beryllium Copper | Beryllium Copper | Polyphenylene Sulfide (PPS) Glass Filled | 32 | 0.1 in | 2.54 mm | 10 µin | 0.25 µm | 0.25 çm | 10 Áin | Closed Frame | Gold |