48-6553 Series

Catalog

CONN IC DIP SOCKET ZIF 48POS GLD

Part	Material Flammability Rating	Termination Post Length	Termination Post Length	Current Rating (Amps)	Number of Positions or Pins (Grid) [y]	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [x]	Features	Termination	Contact Finish - Post	Pitch - Post	Pitch - Post	Mounting Type	Contact Material - Post	Housing Material	Contact Material - Mating	Pitch - Mating	Pitch - Mating	Contact Finish - Mating	Type	Type	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Operating Temperature [Min]	Operating Temperature [Max]
Aries Electronics 48-6553-11	UL94 V-0	0.11 in	2.78 mm	1 A	2	48	24	Closed Frame	Solder	Gold	0.1 in	2.54 mm	Through Hole	Beryllium Copper	Polyphenylene Sulfide (PPS) Glass Filled	Beryllium Copper	0.1 "	2.54 mm	Gold	DIP ZIF (ZIP)	0.6 " (15.24mm) Row Spacing
Aries Electronics 48-6553-10	UL94 V-0	0.11 in	2.78 mm	1 A	2	48	24	Closed Frame	Solder	Tin	0.1 in	2.54 mm	Through Hole	Beryllium Copper	Polyphenylene Sulfide (PPS) Glass Filled	Beryllium Copper	0.1 "	2.54 mm		DIP ZIF (ZIP)	0.6 " (15.24mm) Row Spacing	200 µin	5.08 µm	5.08 µm	200 µin
Aries Electronics 48-6553-18	UL94 V-0	0.11 in	2.78 mm	1 A	2	48	24	Closed Frame	Solder	Nickel Boron	0.1 in	2.54 mm	Through Hole	Beryllium Nickel	Polyetheretherketone (PEEK) Glass Filled	Beryllium Nickel	0.1 "	2.54 mm	Nickel Boron	DIP ZIF (ZIP)	0.6 " (15.24mm) Row Spacing	50 µin	1.27 µm	1.27 µm	50 µin	-55 C	250 °C
Aries Electronics 48-6553-16	UL94 V-0	0.11 in	2.78 mm	1 A	2	48	24	Closed Frame	Solder	Nickel Boron	0.1 in	2.54 mm	Through Hole	Beryllium Copper	Polyphenylene Sulfide (PPS) Glass Filled	Beryllium Copper	0.1 "	2.54 mm	Nickel Boron	DIP ZIF (ZIP)	0.6 " (15.24mm) Row Spacing	50 µin	1.27 µm	1.27 µm	50 µin