35-0518 Series

Catalog

CONN SOCKET SIP 35POS GOLD

Part	Termination Post Length	Termination Post Length	Material Flammability Rating	Current Rating (Amps)	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Finish - Post	Contact Material - Mating	Features	Pitch - Mating	Pitch - Mating	Contact Material - Post [custom]	Housing Material	Type	Contact Finish - Mating	Termination	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Mounting Type	Number of Positions or Pins (Grid)	Pitch - Post	Pitch - Post
Aries Electronics 35-0518-00	1.17 mm	0.046 in	UL94 V-0	3 A	0.25 µm	10 µin	Tin	Beryllium Copper	Open Frame	0.1 "	2.54 mm	Brass	Polyamide (PA46) Nylon 4/6 Glass Filled	SIP	Gold	Solder	200 µin	5.08 µm	Surface Mount	35	0.1 in	2.54 mm
Aries Electronics 35-0518-11	3.18 mm	0.125 in	UL94 V-0	3 A	0.25 µm	10 µin	Gold	Beryllium Copper	Open Frame	0.1 "	2.54 mm	Brass	Polyamide (PA46) Nylon 4/6 Glass Filled	SIP	Gold	Solder	10 Áin	0.25 çm	Through Hole	35	0.1 in	2.54 mm
Aries Electronics 35-0518-10	3.18 mm	0.125 in	UL94 V-0	3 A	0.25 µm	10 µin	Tin	Beryllium Copper	Open Frame	0.1 "	2.54 mm	Brass	Polyamide (PA46) Nylon 4/6 Glass Filled	SIP	Gold	Solder	200 µin	5.08 µm	Through Hole	35	0.1 in	2.54 mm
Aries Electronics 35-0518-10T	3.18 mm	0.125 in	UL94 V-0	3 A	0.25 µm	10 µin	Tin	Beryllium Copper	Open Frame	0.1 "	2.54 mm	Brass	Polyamide (PA46) Nylon 4/6 Glass Filled	SIP	Gold	Solder	200 µin	5.08 µm	Through Hole	35	0.1 in	2.54 mm
Aries Electronics 35-0518-11H	3.18 mm	0.125 in	UL94 V-0	3 A	0.25 µm	10 µin	Gold	Beryllium Copper	Open Frame	0.1 "	2.54 mm	Brass	Polyamide (PA46) Nylon 4/6 Glass Filled	SIP	Gold	Solder	10 Áin	0.25 çm	Through Hole	35	0.1 in	2.54 mm
Aries Electronics 35-0518-10H	3.18 mm	0.125 in	UL94 V-0	3 A	0.25 µm	10 µin	Tin	Beryllium Copper	Open Frame	0.1 "	2.54 mm	Brass	Polyamide (PA46) Nylon 4/6 Glass Filled	SIP	Gold	Solder	200 µin	5.08 µm	Through Hole	35	0.1 in	2.54 mm