06-2513 Series

Catalog

CONN IC DIP SOCKET 6POS GOLD

Part	Termination Post Length	Termination Post Length	Current Rating (Amps)	Material Flammability Rating	Termination	Contact Finish - Mating	Features	Contact Finish - Post	Number of Positions or Pins (Grid) [y]	Number of Positions or Pins (Grid) [x]	Number of Positions or Pins (Grid)	Type	Type	Contact Material - Mating	Mounting Type	Housing Material	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Material - Post [custom]	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Pitch - Post	Pitch - Post	Operating Temperature [Min]	Operating Temperature [Max]	Pitch - Mating	Pitch - Mating
Aries Electronics 06-2513-10H	0.125 in	3.18 mm	3 A	UL94 V-0	Solder	Gold	Closed Frame	Tin	3 positions or pins	2	6	DIP	5.08 mm	Beryllium Copper	Through Hole	Polyamide (PA46) Nylon 4/6 Glass Filled	200 µin	5.08 µm	Brass	0.25 µm	10 µin	0.1 in	2.54 mm	-55 C	105 ░C	0.1 "	2.54 mm
Aries Electronics 06-2513-11H	0.125 in	3.18 mm	3 A	UL94 V-0	Solder	Gold	Closed Frame	Gold	3 positions or pins	2	6	DIP	5.08 mm	Beryllium Copper	Through Hole	Polyamide (PA46) Nylon 4/6 Glass Filled	10 Áin	0.25 çm	Brass	0.25 µm	10 µin	0.1 in	2.54 mm	-55 C	105 ░C	0.1 "	2.54 mm
Aries Electronics 06-2513-11	0.125 in	3.18 mm	3 A	UL94 V-0	Solder	Gold	Closed Frame	Gold	3 positions or pins	2	6	DIP	5.08 mm	Beryllium Copper	Through Hole	Polyamide (PA46) Nylon 4/6 Glass Filled	10 Áin	0.25 çm	Brass	0.25 µm	10 µin	0.1 in	2.54 mm	-55 C	105 ░C	0.1 "	2.54 mm