23-0518 Series
Manufacturer: Aries Electronics
Beta
⌘K
CONN SOCKET SIP 23POS GOLD
| Part | Termination Post Length | Termination Post Length | Material Flammability Rating | Current Rating (Amps) | Type | Contact Finish - Post | Contact Material - Post [custom] | Contact Material - Mating | Mounting Type | Number of Positions or Pins (Grid) | Pitch - Post | Pitch - Post | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Housing Material | Termination | Features | Contact Finish - Mating | Pitch - Mating | Pitch - Mating | Contact Finish Thickness - Post | Contact Finish Thickness - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Aries Electronics | 0.125 in | 3.18 mm | UL94 V-0 | 3 A | SIP | Gold | Brass | Beryllium Copper | Through Hole | 23 | 0.1 in | 2.54 mm | 0.25 µm | 10 µin | Polyamide (PA46) Nylon 4/6 Glass Filled | Solder | Open Frame | Gold | 0.1 " | 2.54 mm | 10 Áin | 0.25 çm |
Aries Electronics | 0.125 in | 3.18 mm | UL94 V-0 | 3 A | SIP | Tin | Brass | Beryllium Copper | Through Hole | 23 | 0.1 in | 2.54 mm | 0.25 µm | 10 µin | Polyamide (PA46) Nylon 4/6 Glass Filled | Solder | Open Frame | Gold | 0.1 " | 2.54 mm | 200 µin | 5.08 µm |
Aries Electronics | 0.046 in | 1.17 mm | UL94 V-0 | 3 A | SIP | Tin | Brass | Beryllium Copper | Surface Mount | 23 | 0.1 in | 2.54 mm | 0.25 µm | 10 µin | Polyamide (PA46) Nylon 4/6 Glass Filled | Solder | Open Frame | Gold | 0.1 " | 2.54 mm | 200 µin | 5.08 µm |
Aries Electronics | 0.125 in | 3.18 mm | UL94 V-0 | 3 A | SIP | Tin | Brass | Beryllium Copper | Through Hole | 23 | 0.1 in | 2.54 mm | 0.25 µm | 10 µin | Polyamide (PA46) Nylon 4/6 Glass Filled | Solder | Open Frame | Gold | 0.1 " | 2.54 mm | 200 µin | 5.08 µm |