32-3574 Series

Catalog

CONN IC DIP SOCKET ZIF 32POS

Part	Termination Post Length	Termination Post Length	Current Rating (Amps)	Material Flammability Rating	Contact Material - Mating	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Pitch - Mating	Pitch - Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Number of Positions or Pins (Grid)	Housing Material	Pitch - Post	Pitch - Post	Contact Finish - Post	Termination	Mounting Type	Type	Type	Type	Contact Finish - Mating	Features	Contact Material - Post
Aries Electronics 32-3574-11	0.11 in	2.78 mm	1 A	UL94 V-0	Beryllium Nickel	1.27 µm	50 µin	0.1 "	2.54 mm	50 µin	1.27 µm	32	Polyphenylene Sulfide (PPS) Glass Filled	0.1 in	2.54 mm	Nickel Boron	Solder	Through Hole	DIP ZIF (ZIP)	7.62 mm	0.3 in	Nickel Boron	Closed Frame	Beryllium Nickel
Aries Electronics 32-3574-18	0.11 in	2.78 mm	1 A	UL94 V-0	Beryllium Nickel	1.27 µm	50 µin	0.1 "	2.54 mm	50 µin	1.27 µm	32	Polyphenylene Sulfide (PPS) Glass Filled	0.1 in	2.54 mm	Nickel Boron	Solder	Through Hole	DIP ZIF (ZIP)	7.62 mm	0.3 in	Nickel Boron	Closed Frame	Beryllium Nickel
Aries Electronics 32-3574-10	0.11 in	2.78 mm	1 A	UL94 V-0	Beryllium Nickel	1.27 µm	50 µin	0.1 "	2.54 mm	50 µin	1.27 µm	32	Polyphenylene Sulfide (PPS) Glass Filled	0.1 in	2.54 mm	Nickel Boron	Solder	Through Hole	DIP ZIF (ZIP)	7.62 mm	0.3 in	Nickel Boron	Closed Frame	Beryllium Nickel