48-6551 Series
Manufacturer: Aries Electronics
CONN IC DIP SOCKET ZIF 48POS TIN
| Part | Material Flammability Rating | Termination Post Length | Termination Post Length | Current Rating (Amps) | Features | Mounting Type | Type | Type | Contact Finish - Post | Number of Positions or Pins (Grid) [y] | Number of Positions or Pins (Grid) [custom] | Number of Positions or Pins (Grid) [x] | Pitch - Mating | Pitch - Mating | Contact Material - Mating | Contact Material - Post | Housing Material | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Termination | Pitch - Post | Pitch - Post | Contact Finish - Mating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | UL94 V-0 | 0.11 in | 2.78 mm | 1 A | Closed Frame | Through Hole | DIP ZIF (ZIP) | 0.6 " (15.24mm) Row Spacing | Tin | 2 | 48 | 24 | 0.1 " | 2.54 mm | Beryllium Copper | Beryllium Copper | Polyphenylene Sulfide (PPS) Glass Filled | 200 µin | 5.08 µm | 5.08 µm | 200 µin | Solder | 0.1 in | 2.54 mm | |
Aries Electronics | UL94 V-0 | 0.11 in | 2.78 mm | 1 A | Closed Frame | Through Hole | DIP ZIF (ZIP) | 0.6 " (15.24mm) Row Spacing | Nickel Boron | 2 | 48 | 24 | 0.1 " | 2.54 mm | Beryllium Copper | Beryllium Copper | Polyphenylene Sulfide (PPS) Glass Filled | 50 µin | 1.27 µm | 1.27 µm | 50 µin | Solder | 0.1 in | 2.54 mm | Nickel Boron |