28-650 Series

Catalog

SOCKET ADAPTER SOIC TO 28DIP 0.6

Part	Contact Material - Post [custom]	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Termination Post Length	Termination Post Length	Board Material	Number of Pins	Termination	Mounting Type	Contact Finish - Post	Convert From (Adapter End)	Pitch - Mating	Pitch - Mating	Pitch - Post	Pitch - Post	Convert To (Adapter End)	Convert To (Adapter End)	Convert To (Adapter End)	Contact Finish - Mating	Size / Dimension [x]	Size / Dimension [y]	Size / Dimension [y]	Size / Dimension [x]	Board Thickness	Board Thickness	Board Thickness	Package Accepted	Material	Proto Board Type	Number of Positions	Pitch	Pitch	Current Rating (Amps)	Material Flammability Rating	Number of Positions or Pins (Grid)	Operating Temperature [Min]	Operating Temperature [Max]	Contact Material - Mating	Housing Material	Type [custom]	Type [custom]	Type	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Features	Contact Material - Post
Aries Electronics 28-650000-11-RC-P	Brass	10 Áin	0.25 çm	0.125 in	3.18 mm	FR4 Epoxy Glass	28	Solder	Through Hole	Gold	SOIC	1.27 mm	0.05 in	0.1 in	2.54 mm	15.24 mm	0.6 in	DIP	Gold
Aries Electronics 28-650000-11-RC																				2.8 in	0.7 in	17.78 mm	71.12 mm	1.57 mm	0.062 "	0.0625 in	SOIC	FR4 Epoxy Glass	SMD to DIP	28	0.05 in	1.27 mm
Aries Electronics 28-6508-211	Brass	10 Áin	0.25 çm	0.5 in	12.7 mm			Wire Wrap	Through Hole	Gold		2.54 mm	0.1 "	0.1 in	2.54 mm				Gold														3 A	UL94 V-0	28	-55 C	125 °C	Beryllium Copper	Polyamide (PA46) Nylon 4/6 Glass Filled	15.24 mm	0.6 in	DIP	0.76 Ám	30 Áin	Open Frame
Aries Electronics 28-6503-31		10 Áin	0.25 çm	0.5 in	12.7 mm			Wire Wrap	Through Hole	Gold		2.54 mm	0.1 "	0.1 in	2.54 mm				Gold														3 A	UL94 V-0	28	-55 C	125 °C	Beryllium Copper	Polyamide (PA46) Nylon 4/6 Glass Filled	15.24 mm	0.6 in	DIP	0.25 µm	10 µin	Closed Frame	Phosphor Bronze
Aries Electronics 28-650000-10-P	Brass			0.125 in	3.18 mm	FR4 Epoxy Glass	28	Solder	Through Hole	Tin-Lead	SOIC	1.27 mm	0.05 in	0.1 in	2.54 mm	15.24 mm	0.6 in	DIP
Aries Electronics 28-6501-21		10 Áin	0.25 çm	0.41 in	10.41 mm			Wire Wrap	Through Hole	Gold		2.54 mm	0.1 "	0.1 in	2.54 mm				Gold														1.5 A	UL94 V-0	28	-55 C	125 °C	Phosphor Bronze	Polyamide (PA46) Nylon 4/6 Glass Filled	15.24 mm	0.6 in	DIP	0.25 µm	10 µin	Closed Frame	Phosphor Bronze
Aries Electronics 28-6503-30		200 µin	5.08 µm	0.5 in	12.7 mm			Wire Wrap	Through Hole	Tin		2.54 mm	0.1 "	0.1 in	2.54 mm				Gold														3 A	UL94 V-0	28	-55 C	105 ░C	Beryllium Copper	Polyamide (PA46) Nylon 4/6 Glass Filled	15.24 mm	0.6 in	DIP	0.25 µm	10 µin	Closed Frame	Phosphor Bronze
Aries Electronics 28-6508-202	Brass	200 µin	5.08 µm	0.36 in	9.14 mm			Wire Wrap	Through Hole	Tin		2.54 mm	0.1 "	0.1 in	2.54 mm				Gold														3 A	UL94 V-0	28	-55 C	105 ░C	Beryllium Copper	Polyamide (PA46) Nylon 4/6 Glass Filled	15.24 mm	0.6 in	DIP	0.76 Ám	30 Áin	Open Frame
Aries Electronics 28-6508-21	Brass	10 Áin	0.25 çm	0.5 in	12.7 mm			Wire Wrap	Through Hole	Gold		2.54 mm	0.1 "	0.1 in	2.54 mm				Gold														3 A	UL94 V-0	28	-55 C	125 °C	Beryllium Copper	Polyamide (PA46) Nylon 4/6 Glass Filled	15.24 mm	0.6 in	DIP	0.76 Ám	30 Áin	Open Frame
Aries Electronics 28-6501-31		10 Áin	0.25 çm	0.69 in	17.52 mm			Wire Wrap	Through Hole	Gold		2.54 mm	0.1 "	0.1 in	2.54 mm				Gold														1.5 A	UL94 V-0	28	-55 C	125 °C	Phosphor Bronze	Polyamide (PA46) Nylon 4/6 Glass Filled	15.24 mm	0.6 in	DIP	0.25 µm	10 µin	Closed Frame	Phosphor Bronze