658-60 Series

Catalog

HEAT SINK, BGA, 27.9 MM, 15.24 MM, 28 MM

Part	Attachment Method	Fin Height	Fin Height	Package Cooled	Material Finish	Power Dissipation @ Temperature Rise	Shape	Width	Width [x]	Material	Thermal Resistance @ Forced Air Flow	Type	Length	Length	Fin Height [z]	Fin Height [z]
Wakefield Thermal Solutions 658-60ABT1E	Thermal Tape Adhesive (Included)	15.24 mm	0.6 in	BGA	Black Anodized	2.5 W 30 °C	Pin Fins Square	27.94 mm	1.1 in	Aluminum	2 °C/W	Top Mount	27.94 mm	1.1 in
Wakefield Thermal Solutions 658-60ABT3	Thermal Tape Adhesive (Included)			BGA	Black Anodized	2.5 W 30 °C	Pin Fins Square	27.94 mm	1.1 in	Aluminum	2 °C/W	Top Mount	27.94 mm	1.1 in	15.2 mm	0.598 "
Wakefield Thermal Solutions 658-60AB	Thermal Tape Adhesive			BGA	Black Anodized	2.5 W 30 °C	Pin Fins Square	27.94 mm	1.1 in	Aluminum	2 °C/W	Top Mount	27.94 mm	1.1 in	15.2 mm	0.598 "
Wakefield Thermal Solutions 658-60ABT3	Thermal Tape Adhesive (Included)			BGA	Black Anodized	2.5 W 30 °C	Pin Fins Square	27.94 mm	1.1 in	Aluminum	2 °C/W	Top Mount	27.94 mm	1.1 in	15.2 mm	0.598 "
Wakefield Thermal Solutions 658-60ABT1E	Thermal Tape Adhesive (Included)	15.24 mm	0.6 in	BGA	Black Anodized	2.5 W 30 °C	Pin Fins Square	27.94 mm	1.1 in	Aluminum	2 °C/W	Top Mount	27.94 mm	1.1 in
Wakefield Thermal Solutions 658-60AB	Thermal Tape Adhesive			BGA	Black Anodized	2.5 W 30 °C	Pin Fins Square	27.94 mm	1.1 in	Aluminum	2 °C/W	Top Mount	27.94 mm	1.1 in	15.2 mm	0.598 "