28-C300 Series

Catalog

CONN IC DIP SOCKET 28POS GOLD

Part	Material Flammability Rating	Current Rating (Amps)	Termination Post Length	Termination Post Length	Housing Material	Number of Positions or Pins (Grid)	Pitch - Post	Pitch - Post	Contact Finish - Post	Contact Material - Post [custom]	Mounting Type	Features	Contact Material - Mating	Termination	Pitch - Mating	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Operating Temperature [Min]	Operating Temperature [Max]	Type [custom]	Type [custom]	Type	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating
Aries Electronics 28-C300-00	UL94 V-0	3 A	0.04 in	1.02 mm	Polyamide (PA46) Nylon 4/6 Glass Filled	28	0.1 in	2.54 mm	Tin	Brass	Surface Mount	Closed Frame	Beryllium Copper	Solder	0.1 "	2.54 mm	Gold	200 µin	5.08 µm	-55 C	105 ░C	15.24 mm	0.6 in	DIP	0.25 µm	10 µin
Aries Electronics 28-C300-30	UL94 V-0	3 A	0.04 in	1.02 mm	Polyamide (PA46) Nylon 4/6 Glass Filled	28	0.1 in	2.54 mm	Tin	Brass	Through Hole	Closed Frame	Beryllium Copper	Wire Wrap	0.1 "	2.54 mm	Gold	200 µin	5.08 µm	-55 C	105 ░C	15.24 mm	0.6 in	DIP	0.25 µm	10 µin
Aries Electronics 28-C300-21	UL94 V-0	3 A	0.04 in	1.02 mm	Polyamide (PA46) Nylon 4/6 Glass Filled	28	0.1 in	2.54 mm	Gold	Brass	Through Hole	Closed Frame	Beryllium Copper	Wire Wrap	0.1 "	2.54 mm	Gold	10 Áin	0.25 çm	-55 C	125 °C	15.24 mm	0.6 in	DIP	0.25 µm	10 µin