44-6552 Series

Catalog

CONN IC DIP SOCKET ZIF 44POS

Part	Termination Post Length	Termination Post Length	Material Flammability Rating	Current Rating (Amps)	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Material - Post	Contact Material - Mating	Mounting Type	Termination	Type	Type	Contact Finish - Post	Pitch - Mating	Pitch - Mating	Features	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Pitch - Post	Pitch - Post	Contact Finish - Mating	Housing Material	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid)	Operating Temperature [Min]	Operating Temperature [Max]
Aries Electronics 44-6552-16	0.11 in	2.78 mm	UL94 V-0	1 A	50 µin	1.27 µm	Beryllium Copper	Beryllium Copper	Through Hole	Solder	DIP ZIF (ZIP)	0.6 " (15.24mm) Row Spacing	Nickel Boron	0.1 "	2.54 mm	Closed Frame	1.27 µm	50 µin	0.1 in	2.54 mm	Nickel Boron	Polyphenylene Sulfide (PPS) Glass Filled	2 22	44
Aries Electronics 44-6552-18	0.11 in	2.78 mm	UL94 V-0	1 A	50 µin	1.27 µm	Beryllium Nickel	Beryllium Nickel	Through Hole	Solder	DIP ZIF (ZIP)	0.6 " (15.24mm) Row Spacing	Nickel Boron	0.1 "	2.54 mm	Closed Frame	1.27 µm	50 µin	0.1 in	2.54 mm	Nickel Boron	Polyetheretherketone (PEEK) Glass Filled	2 22	44	-55 C	250 °C