28-6575 Series
Manufacturer: Aries Electronics
Beta
⌘K
CONN IC DIP SOCKET ZIF 28POS TIN
| Part | Current Rating (Amps) | Material Flammability Rating | Termination Post Length | Termination Post Length | Contact Material - Post | Housing Material | Contact Material - Mating | Type | Type | Pitch - Post | Pitch - Post | Termination | Features | Mounting Type | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Number of Positions or Pins (Grid) | Contact Finish - Post | Pitch - Mating | Pitch - Mating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Aries Electronics | 1 A | UL94 V-0 | 0.11 in | 2.78 mm | Beryllium Copper | Polyphenylene Sulfide (PPS) Glass Filled | Beryllium Copper | DIP ZIF (ZIP) | 0.6 " (15.24mm) Row Spacing | 0.1 in | 2.54 mm | Solder | Closed Frame | Through Hole | 5.08 µm | 200 µin | 200 µin | 5.08 µm | 28 | Tin | 0.1 " | 2.54 mm |
Aries Electronics | 1 A | UL94 V-0 | 0.11 in | 2.78 mm | Beryllium Copper | Polyphenylene Sulfide (PPS) Glass Filled | Beryllium Copper | DIP ZIF (ZIP) | 0.6 " (15.24mm) Row Spacing | 0.1 in | 2.54 mm | Solder | Closed Frame | Through Hole | 5.08 µm | 200 µin | 200 µin | 5.08 µm | 28 | Tin | 0.1 " | 2.54 mm |
Aries Electronics | 1 A | UL94 V-0 | 0.11 in | 2.78 mm | Beryllium Copper | Polyphenylene Sulfide (PPS) Glass Filled | Beryllium Copper | DIP ZIF (ZIP) | 0.6 " (15.24mm) Row Spacing | 0.1 in | 2.54 mm | Solder | Closed Frame | Through Hole | 5.08 µm | 200 µin | 200 µin | 5.08 µm | 28 | Tin | 0.1 " | 2.54 mm |