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1N6474US-e3 Series

Voidless-Hermetically sealed Surface Mount unidirectional Transient Voltage Suppressors (TVS)

Manufacturer: Microchip Technology

Catalog

Voidless-Hermetically sealed Surface Mount unidirectional Transient Voltage Suppressors (TVS)

Key Features

* High surge current and peak pulse power provides transient voltage protection for sensitive circuits
* Triple-layer passivation
* Internal "Category 1" metallurgical bonds
* Voidless hermetically sealed glass package
* JAN, JANTX, and JANTXV military qualifications available per MIL-PRF-19500/516
* JANS available for 1N6103 thru 1N6118A per MIL-PRF-19500/516 as well as fruther options for screening in reference to MIL-PRF-19500 for all other product in this series
* RoHS compliant versions available
* Extremely robust construction
* Working Peak Standoff Voltage (VWM) from 5.7 to 152 V
* 500 watt peak pulse power
* ESD and EFT protection per IEC 61000-4-2 and IEC 61000-4-4
* Secondary lightning protection per IEC 61000-4-5
* Non-sensitive to ESD per MIL-STD-750 method 1020
* Inherently radiation hard as described in MicroNote 050: Radiation Hardened Performance of Discrete Semiconductor Products

Description

AI
This surface mount series of industry recognized voidless-hermetically-sealed Unidirectional Transient Voltage Suppressor (TVS) designs is military qualified to MIL-PRF-19500/552 and are ideal for high-reliability applications where a failure cannot be tolerated. They provide a Working Peak "Standoff" Voltage selection from 5.0 to 51.6 Volts with 1500 W ratings. They are very robust in hard-glass construction and also use an internal metallurgical bond identified as Category I for high reliability applications. The 1500 W series is military qualified to MIL-PRF-19500/552. These devices are also available in axial-leaded packages for thru-hole mounting by deleting the ?US? suffix (see separate data sheet for 1N6469 thru 1N6476A). Microchip also offers numerous other TVS products to meet higher and lower peak pulse power and voltage ratings in both through-hole and surface-mount packages.